Affordable Fiber Communication Board
US$6.55-6.60 / Piece
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$6.60

1,000+ Pieces US$6.55

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 133*88mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.15mm/0.2mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Immersion Gold

Product Description

Specifications: Layers: 4 Thickness:1.6mm Material: FR4 KB6165 Size: 133*88mm Surface treatment: Immersion gold Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask color: Green Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ Features: 1. The integration of the ...

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Affordable Fiber Communication Board Comparison
Transaction Info
Price US $ 6.55-6.60/ Piece US $ 1.00-4.00/ Piece US $ 1.00-4.00/ Piece US $ 0.06-0.10/ PCS US $ 1.00-4.00/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 PCS 1 Pieces
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, Western Union, Paypal, Cash L/C, T/T, Western Union, Paypal, Cash L/C, T/T, Western Union L/C, T/T, Western Union, Paypal, Cash
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 14000, IATF16949, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 14000, IATF16949, GMP
Trade Capacity
Export Markets - North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM, Others OEM, ODM, Others OEM OEM, ODM, Others
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Immersion Gold;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier