What is Dual Layer PCB for Electrical Power Systems

Name: Dual Layer PCB for Electrical Power Systems
Uploaded: 2024-05-27T17:41:51+08:00
Description: We have professional team, using automation, digitization to greatly improve pcb production efficiency and reduce PCB procurement costs. We do many keyboard PCB, and we also have other 61 keys, 86 key

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About this Item

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$2.80

1,000+ Pieces US$2.75

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Computer
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm
Transport Package Vacuum Packaging
Specification 45*65mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.25mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment HASL

Product Description

We have professional team, using automation, digitization to greatly improve pcb production efficiency and reduce PCB procurement costs. We do many keyboard PCB, and we also have other 61 keys, 86 keys, 101 keys, 104 keys, Win98 keyboard models. We are able to produce high quality keyboard PCB ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Innovative PCB for GPS System Comparison

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Transaction Info
	Quick View Dual Layer PCB for Electrical Power Systems Contact Now	Fiberglasss Cloth Base Fr4 Ccl Copper Clad Laminated Sheet for Double Side Layer PCB Contact Now	Fiberglass Base Fr4-Ccl Copper Clad Laminated Sheet Contact Now	Professional Manufacturer Phenolic Base Xpc Al Ccl Copper Clad Laminated Sheet Contact Now	China Supplier Hot Product Fr4 Ccl Copper Clad Laminate for Single Side PCB Contact Now
Price	US $ 2.75-2.80/ Piece	Negotiable	Negotiable	Negotiable	Negotiable
Min Order	10 Pieces	50 Square Meters	50 Square Meters	50 Square Meters	50 Square Meters
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T	L/C, T/T	L/C, T/T	L/C, T/T
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	-	-	-	-
Trade Capacity
Export Markets	-	North America, South America, Europe	North America, South America, Europe	North America, South America, Europe	North America, South America, Europe
Annual Export Revenue	-	> US $100 Million	> US $100 Million	> US $100 Million	> US $100 Million
Business Model	OEM, ODM	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: HASL;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.	Shandong Senrong New Materials Co., Ltd.
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