What is Four Multilayer PCB Board for Ipads with Immersion Gold

Name: Four Multilayer PCB Board for Ipads with Immersion Gold
Uploaded: 2024-04-17T17:46:40+08:00
Description: Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size: 100*90mm Surface treatment:HASL Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask color: Blue Finished copper thickne

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$3.92

1,000+ Pieces US$3.91

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm
Transport Package Vacuum Packaging
Specification 100*90mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.25mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment Immersion Gold

Product Description

Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size: 100*90mm Surface treatment:HASL Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask color: Blue Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ Features: 1. The integration of ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Advanced PCB Technology Comparison

	Quick View Four Multilayer PCB Board for Ipads with Immersion Gold Contact Now	Quick View Professional PCB Board Manufacturer 1-20 Layers PCBA Assembly Contact Now	Quick View Electronic Printed Circuit Board Manufacturing SMT DIP Board PCB PCBA Assembly Contact Now	Quick View Expertise in Industrial PCBA Control Board PCB Assembly Solution Manufacturer Contact Now	Quick View China Professional Mc PCB Ceramic Substrate PCB Manufacturer with Electronic Products Manufacturer Contact Now

Transaction Info
	Quick View Four Multilayer PCB Board for Ipads with Immersion Gold Contact Now	Quick View Professional PCB Board Manufacturer 1-20 Layers PCBA Assembly Contact Now	Quick View Electronic Printed Circuit Board Manufacturing SMT DIP Board PCB PCBA Assembly Contact Now	Quick View Expertise in Industrial PCBA Control Board PCB Assembly Solution Manufacturer Contact Now	Quick View China Professional Mc PCB Ceramic Substrate PCB Manufacturer with Electronic Products Manufacturer Contact Now
Price	US $ 3.91-3.92/ Piece	US $ 0.87-5.00/ Piece	US $ 0.76-5.00/ Piece	US $ 0.80-8.00/ Piece	US $ 0.1/ PCS
Min Order	10 Pieces	10 Pieces	10 Pieces	10 Pieces	1 PCS
Trade Terms	-	-	-	-	FOB, DAT, DDP, DAP, CIP, CPT, EXW
Payment Terms	T/T	T/T, D/P, Paypal, Money Gram	T/T	T/T	L/C, T/T, D/P, Paypal
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets	-	Domestic	Domestic	Domestic	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: AIN; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Uc; Surface Finihsing: HASL-Lf; Board Layer: 2 Layers; Lead Time: 6 Working Days;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Ucreate PCB Co., Ltd.
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