Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 6mil;
Surfaec Treatment: OSP;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Szx;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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Type: Flexible Circuit Board;
Flame Retardant Properties: V1;
Dielectric: FR-6;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Medical Instruments;
Mechanical Rigid: Rigid;
Material: The Paper Ring Gas Resin;
Brand: Tec;
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Type: Flexible Circuit Board;
Flame Retardant Properties: V1;
Dielectric: FR-6;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Medical Instruments;
Mechanical Rigid: Rigid;
Material: The Paper Ring Gas Resin;
Brand: Tec;
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Type: Rigid Circuit Board, Rigid Circuit Board;
Flame Retardant Properties: V0, V0;
Dielectric: FR-4, Fr-4;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Application: Consumer Electronics, Consumer Electronics;
Mechanical Rigid: Rigid, Rigid;
Material: Fiberglass Epoxy, Fiberglass Epoxy;
Brand: Szx, Szx;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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