Eight-Layer HDI PCB for Mobile Devices
US$3.85-3.95 / Piece
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$3.95

1,000+ Pieces US$3.85

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Computer
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 100*200mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 0.069mm/0.076mm
  • Surfaec Treatment Enig

Product Description

Specifications: Layers: 6 Thickness:2.0mm Material: FR-4 Size:100*200mm Surface treatment: ENIG Line width/spacing(inner):0.19mm/0.25mmLine width/spacing(outer):0.25mm/0.25mm Minimum aperture:0.35mmSolder mask color: Green Finished copper thickness: 1/1 OZ Features: 1. The integration of ...

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Eight-Layer HDI PCB for Mobile Devices Comparison
Transaction Info
Price US $ 3.85-3.95/ Piece US $ 0.99/ Piece US $ 0.99/ Piece US $ 0.99/ Piece US $ 0.99/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal L/C, T/T, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949
Trade Capacity
Export Markets - - - - -
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - - - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 0.069mm/0.076mm;
Surfaec Treatment: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Tecircuit;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Tecircuit;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Tecircuit;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Tecircuit;
Surface Finish: Enig;
Layer Count: 12;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier