2025 Elsky 3.5 Inch Motherboard with 8th 10th Generation Core I3, I5, I7 DDR 4 Memory VGA/Lvds/Edp/HDMI SATA3.0

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$132.00

100-999 Pieces US$128.00

1,000+ Pieces US$123.00

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 32G
  • Structure 3.5 Inch
  • Memory DDR4
  • SATA Interface SATA3.0
  • CPU Socket Slot 1
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Audio Effects HiFi
  • Transport Package Packing
  • Specification 145mm(L)*100mm(W)*25mm(H)
  • Trademark ELSKY
  • Origin Shenzhen
  • Chipset Manufacture Intel
  • Hard Drive Interface SATA
  • CPU Core I3 I5 I7
  • Operating System Win10/11/Linux
  • Power Supply DC 12/19V
  • SSD M.2, Msata, Mini-Pcie

Product Description

Product Description Motherboard size 145mm(L)*100mm(W)*25mm(H) CPU processor Support 8th generation Whiskey Lake CPU: I3-8145U, I5-8265U, I7-8665U, etc. Support 10th generation Comet Lake CPU: I3-10110U, I5-10210U, I7-10510U, etc. Memory 1*NB-DDR 4 memory slot, support 2133/2400/2666/2933MHz ...

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3.5 Inch Motherboard Comparison
Transaction Info
Price US $ 123.00-132.00/ Piece US $ 183.00-199.00/ Piece US $ 143.00-159.00/ Piece US $ 251.00-274.00/ Piece US $ 228.00-244.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$2.5 Million - US$5 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM, ODM, Own Brand() OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: 3.5 Inch;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: Slot 1;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Chipset Manufacture: Intel;
Hard Drive Interface: SATA;
CPU: Core I3 I5 I7;
Operating System: Win10/11/Linux;
Power Supply: DC 12/19V;
SSD: M.2, Msata, Mini-Pcie;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Nuc Motherboard;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Intel 10th Cometlake-U;
USB: 4*USB2.0 2*USB3.1;
LAN: 2*Intel I211 Network Card;
Display: Mini Dp+HDMI2.0;
RAM: 2*DDR4 2133/2400MHz;
OS Support: Windows10 Linux;
COM: 1*Mini-Pcie;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Nano Motherboard;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Intel 11th Mobile Tiger Lake-U;
USB: 4*USB3.0 2*USB2.0;
LAN: 6*Intel I211at;
Display: HDMI1.4 4K Display;
RAM: Dual Channel DDR4 3200MHz;
OS Support: Windows10 Linux;
COM: 1*Mini-Pcie M-SATA;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Nano Motherboard;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Intel 11th Mobile Tiger Lake-U;
USB: 4*USB3.0 2*USB2.0;
LAN: 6*Intel I211at;
Display: HDMI1.4 4K Display;
RAM: Dual Channel DDR4 3200MHz;
OS Support: Windows10 Linux;
COM: 1*Mini-Pcie M-SATA;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: Nano Motherboard;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Intel 6th Mobile Skylake-U;
USB: 4*USB3.0 2*USB2.0;
LAN: 6*Intel I211at;
Display: HDMI1.4 4K Display;
RAM: Dual Channel DDR4 2133MHz;
OS Support: Windows10 Linux;
COM: 1*Mini-Pcie M-SATA;
Supplier Name

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier