Elsky Qm3100 LGA1151 Core I3 I5 I7 2xddr4 M. 2 4cores 6cores 8cores Socket 8th 9th Generation Pcie X16 H310 Motherboard 1155

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$115.00

100+ Pieces US$105.00

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 8G
  • Structure Mini-ITX
  • Memory DDR4
  • SATA Interface SATA
  • CPU Socket LGA 1155
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Audio Effects Not HiFi
  • Specification 1Piece/Carton(G. W.: 1.0-1.5KG); 5Pieces/Carton(G
  • Trademark inter smart
  • Origin Shenzhen
  • Chipset Manufacture Intel
  • Memory Bank 2 DDR4 DIMM
  • Memory Channel Double
  • Memory Type DDR4, 2*DDR4,up to 32GB Memory
  • Hard Drive Interface SATA, Msata+SATA3.0
  • CPU Type Core I7/Core I5/Core I3/Pentium/Celeron
  • Application Desktop,Industrial PC,Box PC
  • Socket Type LGA 1151

Product Description

Product Description ELSKY QM3100 LGA1151 Core i3 i5 i7 2xDDR4 M.2 4Cores 6Cores 8Cores socket 8th 9th generation PCIE x16 H310 motherboard 1155 Form Factor Standard Mini-ITX,170*170mm(L*W). Processor Support Coffee Lake FCLGA1151 socket, 8th,9th generation Core i3 i5 i7 CPU. Chipset H310 ...

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H310 Chipset Comparison
Transaction Info
Price US $ 105.00-115.00/ Piece US $ 108/ Piece US $ 115/ Piece US $ 0.01/ Piece US $ 57.00-66.00/ Piece
Min Order 1 Pieces 10 Pieces 100 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001 ISO 9001, HSE, QHSE, EICC
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA;
CPU Socket: LGA 1155;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Chipset Manufacture: Intel;
Memory Bank: 2 DDR4 DIMM;
Memory Channel: Double;
Memory Type: DDR4, 2*DDR4,up to 32GB Memory;
Hard Drive Interface: SATA, Msata+SATA3.0;
CPU Type: Core I7/Core I5/Core I3/Pentium/Celeron;
Application: Desktop,Industrial PC,Box PC;
Socket Type: LGA 1151;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Nano Board;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Nano Board;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: Onboard Intel CPU;
Printed Circuit Board: Six Layer;
Main Board Structure: CPU Based;
Audio Effects: HiFi;
RAM: 2*DDR4 SODIMM Memory Slot,up to 64GB;
LAN: 2* Intel Gigabit Ethernet Port;
Serial Ports: 6 COM;
Power: DC 12V Power Supply;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: 570*185mm;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA1150;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Supplier Name

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

R&O Industrial Technology Co., Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier