Thin Fan Motherboard
US$161.00-169.00 / Piece
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What is Hot Sale Fanless Embedded DDR4 Industrial Computer PC Based on 10th Gen Core

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$169.00

10-99 Pieces US$166.00

100-999 Pieces US$164.00

1,000+ Pieces US$161.00

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 64G
  • Structure ATX
  • Memory DDR4, 2xddr4 DIMM Sockets Max Support
  • SATA Interface SATA
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Specification 1Piece/Carton(G. W.: 1.0-1.5KG); 5Pieces/Carton(G
  • Origin Shenzhen
  • CPU 10th Gen Comet Lake CPU:I3-10110u,I5-10210u,I7-105
  • Form Factor Mini-Itx
  • Chipset Manufacturer Intel
  • CPU Type Core I7/Core I5/Core I3/Pentium/Celeron
  • Socket Type Slot 2
  • LAN Single/Dual LAN
  • Application Desktop
  • Memory Bank 2 DDR4 DIMM
  • Graphics Intel UHD Graphics ,Support 4K,1080P,H26
  • Operating System Windows 10 64-Bit,Windows 8,Wind
  • Hard Drive Type SSD+HDD

Product Description

Product Description Specification model:QM10U model:QMmodel:QM10U10U Application Product Uses Packing &Delivery Before delivery,we guarantee that every item will be tested and carefully packed with individual Anti-static bubble bag and separated by stiff cardboards in ...

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Thin Fan Motherboard Comparison
Transaction Info
Price US $ 161.00-169.00/ Piece US $ 55.00-70.00/ Piece US $ 55.00-70.00/ Piece US $ 55.00-70.00/ Piece US $ 55.00-70.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 9000, BS 25999-2 ISO 9001, ISO 9000, BS 25999-2 ISO 9001, ISO 9000, BS 25999-2 ISO 9001, ISO 9000, BS 25999-2
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: ATX;
Memory: DDR4, 2xddr4 DIMM Sockets Max Support;
SATA Interface: SATA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
CPU: 10th Gen Comet Lake CPU:I3-10110u,I5-10210u,I7-105;
Form Factor: Mini-Itx;
Chipset Manufacturer: Intel;
CPU Type: Core I7/Core I5/Core I3/Pentium/Celeron;
Socket Type: Slot 2;
LAN: Single/Dual LAN;
Application: Desktop;
Memory Bank: 2 DDR4 DIMM;
Graphics: Intel UHD Graphics ,Support 4K,1080P,H26;
Operating System: Windows 10 64-Bit,Windows 8,Wind;
Hard Drive Type: SSD+HDD;
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: Customs;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: None;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: Customs;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: None;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: Customs;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: None;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: Customs;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: None;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Supplier Name

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shining Star Electronic Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shining Star Electronic Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shining Star Electronic Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shining Star Electronic Co., Ltd.

China Supplier - Diamond Member Audited Supplier