Factory X86 Dual Edp Mini-Itx Motherboard and Processor 2ND 3rd Gen Core I3 I5 I7 DDR3 8g

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-49 Pieces US$52.00

50+ Pieces US$49.00

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 8G
  • Structure Mini-ITX
  • Memory DDR3
  • SATA Interface SATA2.0
  • CPU Socket Slot1
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Audio Effects HiFi
  • Transport Package Carton
  • Specification 170*170mm
  • Trademark Elsky
  • Origin Shenzhen, China
  • LAN 1 RJ45
  • COM 2

Product Description

Factory X86 Dual EDP Mini-ITX Motherboard and Processor 2nd 3rd Gen Core I3 I5 I7 DDR3 8G Product Description Motherboard size 170(L)mm*170(W)mm*25mm(H) CPU Supports Intel 2nd and 3rd generation CPUs Chipset Intel 6 series chipsets: HM65, HM67, QM67, etc. Intel 7 series chipsets: HM70, ...

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Motherboard Comparison
Transaction Info
Price US $ 49.00-52.00/ Piece US $ 162/ Piece US $ 244/ Piece US $ 191/ Piece US $ 0.01-20.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$2.5 Million - US$5 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$50 Million - US$100 Million
Business Model OEM, ODM, Own Brand() OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia) OEM, ODM, Own Brand(Piesia) OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA2.0;
CPU Socket: Slot1;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
LAN: 1 RJ45;
COM: 2;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 12GB;
Structure: Z-3.5inch Motherboard;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Intel Haswell BGA1168 Serial;
USB: 2*USB3.0;
LAN: 2*Rtl8111e-V Gigabit Network;
COM: 5*RS-232 1*RS422/485(Optional);
Power Supply: DC12V5a/7A;
Display: Support Synchronous or Asynchronous;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 12GB;
Structure: Z-3.5inch Motherboard;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Intel Mobile 5th Broadwell-U I3/I5/I7;
USB: 2*USB3.0 5*USB2.0;
LAN: 2*Rtl8111e-V Gigabit Network;
COM: 5*RS-232 1*RS422/485(Optional);
Power Supply: DC12V5a/7A;
Display: Support Synchronous or Asynchronous;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 12GB;
Structure: Z-3.5inch Motherboard;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Intel Mobile 5th Broadwell-U I3/I5/I7;
USB: 2*USB3.0 5*USB2.0;
LAN: 2*Rtl8111e-V Gigabit Network;
COM: 5*RS-232 1*RS422/485(Optional);
Power Supply: DC12V5a/7A;
Display: Support Synchronous or Asynchronous;
Integrated Graphics: Integrated Graphics;
Main Chipset: It's a PCB;
Maximum Memory Capacity: It's a PCB;
Structure: It's a PCB;
Memory: It's a PCB;
SATA Interface: It's a PCB;
CPU Socket: It's a PCB;
Printed Circuit Board: Four Layers;
Main Board Structure: Circuit Baded;
Audio Effects: Not HiFi;
Supplier Name

Shenzhen Elsky Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier