Elsky Thin Mini Itx Motherboard Qm2360 3th I5-3317u Hm65 DC Power Realtek 8111h DDR3 up to 8GB RAM RS232 COM for HD 4K Display

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-49 Pieces US$85.00

50-99 Pieces US$83.00

100+ Pieces US$80.00

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 8G
  • Structure ATX
  • Memory 1 DDR3 DIMM
  • SATA Interface SATA3.0
  • CPU Socket None
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Transport Package Carton
  • Specification 170*170*25mm(L*W*H)
  • Trademark Intel
  • Origin China
  • Warranty 1 Year
  • Test Condition 100% Tested
  • Fsb / Ht 2.0GHz~2.42GHz

Product Description

Product Name: ELSKY Thin Mini ITX Motherboard QM2360 3th i5-3317U HM65 DC power Realtek 8111H DDR3 up to 8GB RAM RS232 COM for HD 4K Display Price Explanation!!! All of prices are barebone(Motherboard+CPU). If you need Memory,SSD,HDD,WIFI,License operating system,3G,4G,GPS,power adapter and ...

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Motherboard CPU Combo Comparison
Transaction Info
Price US $ 80.00-85.00/ Piece US $ 272/ Piece US $ 57.00-66.00/ Piece US $ 238/ Piece US $ 286/ Piece
Min Order 1 Pieces 10 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: ATX;
Memory: 1 DDR3 DIMM;
SATA Interface: SATA3.0;
CPU Socket: None;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Warranty: 1 Year;
Test Condition: 100% Tested;
Fsb / Ht: 2.0GHz~2.42GHz;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 48GB;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: 570*185mm;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA1150;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Z-3.5inch Motherboard;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: 7th Generation Kaby Lake-U Soc I3/I5/I7 Processor;
USB: 2*USB3.0 6*USB2.0;
LAN: 2*Rtl8111e-V Gigabit Network;
COM: 5*RS-232 1*RS422/485(Optional);
Power Supply: DC12V5a/7A;
Display: Support Synchronous or Asynchronous;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Z-3.5inch Motherboard;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Intel 7th Generation Skylake-Usingle Chip CPU;
USB: 4*USB3.0 4*USB2.0;
LAN: 2*Rtl8111e-V Gigabit Network;
COM: 5*RS-232 1*RS422/485(Optional);
Power Supply: DC12V5a/7A;
Display: Support Synchronous or Asynchronous;
Supplier Name

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier