Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Synthetic Fiber;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
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Type: Rigid Circuit Board;
Dielectric: Kappa 438;
Material: Glass Reinforced Hydrocarbon Ceramic;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 40mil;
Layer Count: 2-Layer;
Application: Distributed Antenna Systems;
Surface Finish: Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: RF-35A2;
Material: PTFE Ceramic Fiberglass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Thickness: 10mil, 20mil, 30mil and 60mil;
Layer Count: Double Layer, Multilayer, Hybrid PCB;
Application: Power Amplifier;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc;
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Type: Rigid Circuit Board;
Dielectric: CEM-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: Trf-45;
Material: Ceramic Filled PTFE;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Thickness: 16mil 24mil 32mil 40mil 64mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Application: GPS Antenna, Satellite Radio, RFID;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
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