What is Yfw4n65amj Yfw4n70amj Yfw4n80amj to-251 Mosfet

Name: Yfw4n65amj Yfw4n70amj Yfw4n80amj to-251 Mosfet
Uploaded: 2023-04-25T11:55:24+08:00
Description: GuangDong Youfeng Microelectronics Co., Ltd. (YFW), founded in June 2013, with its headquarters in Dongguan, China, and factory locate in Changzhou, Jiangsu, is an enterprise specializing in the

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Price

Purchase Qty. Reference FOB Price

1,250-899,999 Pieces US$0.009

900,000-2,999,999 Pieces US$0.006

3,000,000-29,999,999 Pieces US$0.005

30,000,000+ Pieces US$0.04

Sepcifications

Manufacturing Technology Optoelectronic Semiconductor
Material Compound Semiconductor
Type Mosfet
Package DIP(Dual In-line Package)
Signal Processing Analog Digital Composite and Function
Application Consumer Electronics
Model Yfw4n65amj Yfw4n70amj Yfw4n80amj
Batch Number 2022+
Brand Yfw
Transport Package 4K/Reel/Tap, Inner Box, Master
Specification 580*240*165
Trademark YFW
Origin China
Package Outline to-251

Product Description

GuangDong Youfeng Microelectronics Co., Ltd. (YFW), founded in June 2013, with its headquarters in Dongguan, China, and factory locate in Changzhou, Jiangsu, is an enterprise specializing in the research and development, manufacturing and sales of semiconductor products. YFW on full range of ...

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Guangdong Youfeng Microelectronics Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products Diode, Mosfet, Transistor, Tvs, Rectifier Diode, Bridge Rectifier, Electronical Component, ESD, Schottky Diode, Zener Diode
Registered Capital 10000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

Semiconductor Comparison

	Quick View Yfw4n65amj Yfw4n70amj Yfw4n80amj to-251 Mosfet Contact Now	Quick View Microchip MCU 8-Bit Atmega AVR Risc Tqfp T/R - Tape and Reel Atmega8535-16aur Contact Now	Quick View Microchip Ksz9031rnxic Ksz9031rnxvb-Trvao New and Original Transceiver Microchip Contact Now	Quick View Adi Adsp-Ts201sabpz-050 32bit DSP DSC New and Original Adsp-Ts201s Contact Now	Quick View Original Adi Max232eese+T Soic-16 RS-232 Transceiver Chip Integrated Circuits Electronics Components Contact Now

Transaction Info
	Quick View Yfw4n65amj Yfw4n70amj Yfw4n80amj to-251 Mosfet Contact Now	Quick View Microchip MCU 8-Bit Atmega AVR Risc Tqfp T/R - Tape and Reel Atmega8535-16aur Contact Now	Quick View Microchip Ksz9031rnxic Ksz9031rnxvb-Trvao New and Original Transceiver Microchip Contact Now	Quick View Adi Adsp-Ts201sabpz-050 32bit DSP DSC New and Original Adsp-Ts201s Contact Now	Quick View Original Adi Max232eese+T Soic-16 RS-232 Transceiver Chip Integrated Circuits Electronics Components Contact Now
Price	US $ 0.005-0.04/ Piece	US $ 0.50-8.80/ Piece	US $ 0.50-8.80/ Piece	US $ 0.50-8.80/ Piece	US $ 0.50-8.80/ Piece
Min Order	1250 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram, we-chat	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS, CCC, ISO, EPA	RoHS, CCC, ISO, EPA	RoHS, CCC, ISO, EPA	RoHS, CCC, ISO, EPA
Management System Certification	ISO 9001	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets	Eastern Europe, Southeast Asia, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Manufacturing Technology: Optoelectronic Semiconductor; Material: Compound Semiconductor; Type: Mosfet; Package: DIP(Dual In-line Package); Signal Processing: Analog Digital Composite and Function; Application: Consumer Electronics; Model: Yfw4n65amj Yfw4n70amj Yfw4n80amj; Batch Number: 2022+; Brand: Yfw; Package Outline: to-251;	Application: Solar Cell; Batch Number: 2023; Manufacturing Technology: Optoelectronic Semiconductor; Material: Element Semiconductor; Package: DIP(Dual In-line Package); Signal Processing: Simulation; Type: N-Type Semiconductor; Structure: Multilayer Rigid PCB; Dielectric: Fr-4; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Board Thickness: 2mm; Copper Thickness: 1oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 4/4mil; Min. Finished Hole Size: 4mm; Customized: Customized;	Application: Solar Cell; Batch Number: 2023; Manufacturing Technology: Optoelectronic Semiconductor; Material: Element Semiconductor; Package: DIP(Dual In-line Package); Signal Processing: Simulation; Type: N-Type Semiconductor; Structure: Multilayer Rigid PCB; Dielectric: Fr-4; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Board Thickness: 2mm; Copper Thickness: 1oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 4/4mil; Min. Finished Hole Size: 4mm; Customized: Customized;	Dielectric: Fr-4; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Board Thickness: 2mm; Copper Thickness: 1oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 4/4mil; Min. Finished Hole Size: 4mm; Customized: Customized; Manufacturing Technology: Discrete Device; Material: Compound Semiconductor; Type: Intrinsic Semiconductor; Package: QFP/PFP; Signal Processing: Digital; Application: Medical Instruments; Batch Number: 2023;	Application: Solar Cell; Batch Number: 2023; Manufacturing Technology: Optoelectronic Semiconductor; Material: Element Semiconductor; Package: DIP(Dual In-line Package); Signal Processing: Simulation; Type: N-Type Semiconductor; Structure: Multilayer Rigid PCB; Dielectric: Fr-4; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Board Thickness: 2mm; Copper Thickness: 1oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 4/4mil; Min. Finished Hole Size: 4mm; Customized: Customized;
Supplier Name	Guangdong Youfeng Microelectronics Co., Ltd.	Usun Electronics Limited.,	Usun Electronics Limited.,	Usun Electronics Limited.,	Usun Electronics Limited.,
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