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US$0.10-100.00 / Piece

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What is PCB PCBA Factory SMT Other Electronic Components PCB Assembly Service Shenzhen Manufacturer

Name: PCB PCBA Factory SMT Other Electronic Components PCB Assembly Service Shenzhen Manufacturer
Uploaded: 2023-11-16T20:05:09+08:00
Description: Product Details Product Description FAQ Q1:When can I get the quotation? A: We usually quote 1 hour after we get your inquiry. If you are very urgent, please call us or tell us in your email. Q

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About this Item

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$0.10

100+ Pieces US$100.00

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Yldz
Transport Package Vacuum Package and Foam Protected
Trademark YL
Origin China
Test 100% E-Test
Surface Treatment 100% Tin
Board Thickness 0.2-6mm
One Stop Service PCB Assembly, Component Sourcing, Box Building
Solder Mask Green
Layers 1-36 Layers
Copper Thickness 0.5-12oz(18-420um)
Certification RoHS, UL, ISO
a Special Process Carbon Film Printing

Product Description

Product Details Product Description FAQ Q1:When can I get the quotation? A: We usually quote 1 hour after we get your inquiry. If you are very urgent, please call us or tell us in your email. Q2:Can you provide free samples for me? A: Free samples depend on your order quantity. ...

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Wenzhou Yongli Electronics Co, . Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Tin Spraying Plate, Pure iTn Plate, Gold Plate, Aluminum Base Plate, Single Panel, Double Panel, Multilayer Panel
Number of Employees 182
Year of Establishment 1993-08-05
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949, ISO45001:2018 certificate
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCB Comparison

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Transaction Info
	Quick View PCB PCBA Factory SMT Other Electronic Components PCB Assembly Service Shenzhen Manufacturer Contact Now	Quick View Customized PCB Assembly for Smart Home PCBA Contact Now	Quick View Professional Automotive Circuit Board Assembly Manufacturer Electronic PCB Assembly Servo Motor Control Board Contact Now	Quick View Prototype PCB Assembly Printed Circuit Board PCB Board PCBA Service for Smart Products Contact Now	Quick View UPS Board Printed Circuit Board Assembly for Home Appliances Contact Now
Price	US $ 0.10-100.00/ Piece	US $ 0.20-20.00/ Piece	US $ 0.98-5.00/ Piece	US $ 0.87-6.00/ Piece	US $ 0.86-5.00/ Piece
Min Order	10 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P	T/T, D/P, Paypal, Money Gram	T/T	T/T	T/T
Quality Control
Product Certification	RoHS, UL, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	-	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	South America, Europe, Southeast Asia/ Mideast, Africa, Domestic	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Yldz; Test: 100% E-Test; Surface Treatment: 100% Tin; Board Thickness: 0.2-6mm; One Stop Service: PCB Assembly, Component Sourcing, Box Building; Solder Mask: Green; Layers: 1-36 Layers; Copper Thickness: 0.5-12oz(18-420um); a Special Process: Carbon Film Printing;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Wenzhou Yongli Electronics Co, . Ltd	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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