Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Grandtop;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Conformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: OSP;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 0.8mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 8mil/8mil;
Special: Halogen-Free Board, High Reliability;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
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