PCB
US$0.10-100.00 / Piece
View

Single Sided Multi-Layer Circuit Board 24h Batch Fr-4 Fiberglass Board Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$0.10

100+ Pieces US$100.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Yldz
  • Transport Package Vacuum Package and Foam Protected
  • Trademark YL
  • Origin China
  • Test 100% E-Test
  • Surface Treatment 100% Tin
  • Board Thickness 0.2-6mm
  • One Stop Service PCB Assembly, Component Sourcing, Box Building
  • Solder Mask Green
  • Layers 1-36 Layers
  • Copper Thickness 0.5-12oz(18-420um)
  • Certification RoHS, UL, ISO
  • a Special Process Carbon Film Printing

Product Description

Product Details Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 0.10mm Insulation Layer Thickness ...

Learn More

PCB Comparison
Transaction Info
Price US $ 0.10-100.00/ Piece US $ 35/ Piece US $ 35/ Piece US $ 35/ Piece US $ 35/ Piece
Min Order 10 Pieces 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal
Quality Control
Product Certification RoHS, UL, ISO - - - -
Management System Certification - ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE
Trade Capacity
Export Markets South America, Europe, Southeast Asia/ Mideast, Africa, Domestic North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue - - - - -
Business Model - OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 3-6 Month(s)
Peak-season: 1-3 Month(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Supplier Name

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

China Supplier - Diamond Member Audited Supplier