| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Surface Treatment: Gold Finger/Hard Gold;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Solder Mask Color;
Hole Diameter: Green/Black/White/Red/Blue/Yellow;
Min.Line Width: 0.10mm(4mil);
Min.Line Spaceing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max.Finished Board Side: 1020mm*1000mm;
MOQ: No;
Sample Date: 5-7days;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Surface Treatment: Gold Finger/Hard Gold;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min.Line Width: 0.10mm(4mil);
Min.Line Spaceing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max.Finished Board Side: 1020mm*1000mm;
MOQ: No;
Sample Date: 5-7days;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Surface Treatment: Gold Finger/Hard Gold;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min.Line Spaceing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max.Finished Board Side: 1020mm*1000mm;
MOQ: No;
Sample Date: 5-7days;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layers: 1-36layers;
Service: One-Stop Turnkey;
Applicational: Electronics Device/Home Appliances;
Product Type: Custom HDI PCBA;
Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum;
Board Thickness: 0.2mm-7.0mm;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
Copper Thickness: 0.5-12oz(18-420um);
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
PCB QA: E-Test, Aoi, X-ray, Function Test;
Sample Date: 5-7days;
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