Pushing Mould Aluminum 1.6mm PCB with OSP Surface

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Square Meters US$65.00-90.00 / Square Meter

Sepcifications

  • Structure Metal Base Rigid PCB
  • Material Aluminium
  • Production Process Subtractive Process
  • Transport Package Vacuum Packing
  • Specification UL ISO TS16949 IPC
  • Trademark ZAPON
  • Origin China
  • Board Thickness 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm
  • Thermal Conductivity 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K
  • Ccl Brand Jh,Ccaf.etc
  • Sample Date 3-5days

Product Description

Aluminum base copper-clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float. It's widely used for the modifier and sparker on fire for motorcycle and mobile, power LED, ...

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MCPCB Comparison
Transaction Info
Price US $ 65.00-90.00/ Square Meter US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece US $ 0.50-10.00/ Piece
Min Order 5 Square Meters 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms FOB - - - -
Payment Terms L/C, T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA
Management System Certification ISO 9001 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Metal Base Rigid PCB;
Material: Aluminium;
Production Process: Subtractive Process;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Ccl Brand: Jh,Ccaf.etc;
Sample Date: 3-5days;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 4L;
Board Thickness: 1.6mm;
Copper Thickness: 1.5oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 2;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 14L;
Board Thickness: 1.57mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Surface Finish: Enig 3u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 3;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 8L;
Board Thickness: 1.57mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.25mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 2;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Resin;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: S1000-2m/It180A;
Layers: 10L;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Silkscreen Type: White;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.1mm;
Surface Finish: Enig 2u";
X-Outs Allowed: Not Allowed;
Standard: Ipc Class 2;
Customized: Customized;
Supplier Name

Zhejiang Dejia Electronics Technology Co.,Ltd.

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier