Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Mechanical Rigid: Rigid;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: King Field;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: King Field;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: King Field;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: King Field;
Surface Treatment: HASL, Enig, Gold Fingers, etc.;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
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