Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Material Type: Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Material Type: Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Material Type: Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Material Type: Fr4, High Tg, Cem1, Cem3, Aluminiaum Base, Arlon, Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
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