1L Aluminium PCB 3W 1.5mm OSP

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces Negotiable

Sepcifications

  • Structure Single-Sided Rigid PCB
  • Base Material Aluminum
  • Brand Dejia
  • Transport Package Vacuum Package by Sea/Air
  • Specification /
  • Trademark DEJIA
  • Origin China

Product Description

PCB Comparison
Transaction Info
Price Negotiable US $ 1/ Piece US $ 1/ Piece US $ 1/ Piece US $ 1/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P T/T, Paypal T/T, Paypal T/T, Paypal T/T, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949
Trade Capacity
Export Markets Domestic - - - -
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - - -
Product Attributes
Specification
Structure: Single-Sided Rigid PCB;
Base Material: Aluminum;
Brand: Dejia;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Automative;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Tecircuit;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Automative;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Tecircuit;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Automative;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Tecircuit;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Automative;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Tecircuit;
Supplier Name

Zhejiang Dejia Electronics Technology Co.,Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier