2L Aluminum PCB 2W 35um Copper 1.2mm Black Solder Mask Hal Lf with Punching

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About this Item

Price

Min. Order Reference FOB Price

10 Pieces Negotiable

Sepcifications

Structure Double-Sided Rigid PCB
Base Material Aluminum
Brand Dejia
Transport Package Vacuum Package by Sea/Air
Specification /
Trademark DEJIA
Origin China

Product Description

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Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Printed Circuit Board, Aluminum PCB, Printed Circuit Board Assembly, PCB Assembly, PCB Factory, Multilayer Fr4 PCB, Multilayer Aluminum PCB; Copper Base PCB, DTP Copper Base PCB
Number of Employees 70
Year of Establishment 2018-02-06
Management System Certification IATF16949:2016
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	2L Aluminum PCB 2W 35um Copper 1.2mm Black Solder Mask Hal Lf with Punching Contact Now	Quick View 12layer Rigid PCB Tg170 2.4mm HDI 2+N+2 OSP+Enig Contact Now	Quick View Consumer Electronics 14layer Rigid PCB Tg170 2.4mm HDI 2+N+2 OSP+Enig Contact Now	Quick View 12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control Contact Now	Quick View Smart Home 10layer Rigid PCB Tg170 1.6mm HDI 2+N+2 OSP+Enig Impedance Control Contact Now

Transaction Info
	2L Aluminum PCB 2W 35um Copper 1.2mm Black Solder Mask Hal Lf with Punching Contact Now	Quick View 12layer Rigid PCB Tg170 2.4mm HDI 2+N+2 OSP+Enig Contact Now	Quick View Consumer Electronics 14layer Rigid PCB Tg170 2.4mm HDI 2+N+2 OSP+Enig Contact Now	Quick View 12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control Contact Now	Quick View Smart Home 10layer Rigid PCB Tg170 1.6mm HDI 2+N+2 OSP+Enig Impedance Control Contact Now
Price	Negotiable	US $ 2.00-20.00/ Piece	US $ 0.50-10.00/ Piece	US $ 1.00-12.00/ Piece	US $ 0.80-10.00/ Piece
Min Order	10 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	Domestic	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Base Material: Aluminum; Brand: Dejia;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: 1;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: 1;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials;
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