Shenzhen Factory PCBA for Electronic Contract Manufacturing PCBA Box Build One Stop Service

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.15 / Piece

Sepcifications

  • Mode of Production SMT
  • Layers 1-28 Layers
  • Certification ISO
  • Customized Customized
  • Condition New
  • Transport Package Anti-Static Bag
  • Specification PCB board assembly
  • Trademark Custom
  • PCBA Min. IC Pitch 0.30mm(12mil)
  • PCBA Min. Chip Placement 0201
  • Item Electronic PCB Board Assembly
  • Other PCBA Service Conformal Coating
  • PCBA Foot Pin So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA
  • Turnkey Service PCB, PCB Assembly, Box Build
  • Applicaton Industrial PCB PCBA

Product Description

PRODUCT DESCRIPTION PCBA/PCB Assembly/Electronic Assembly/PCB Board/Circuit Board/Printed Circuit Board Layer: 1-40 layer Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. Copper thickness: 0.25 Oz -12 Oz Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers ...

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Box Build PCBA Comparison
Transaction Info
Price US $ 1.15/ Piece US $ 0.30-2.00/ Piece US $ 0.30-2.00/ Piece US $ 0.30-2.00/ Piece US $ 0.30-2.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union
Quality Control
Product Certification ISO RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification ISO 9001, IATF16949, QC 080000 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Mode of Production: SMT;
Layers: 1-28 Layers;
Customized: Customized;
Condition: New;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Min. Chip Placement: 0201;
Item: Electronic PCB Board Assembly;
Other PCBA Service: Conformal Coating;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Turnkey Service: PCB, PCB Assembly, Box Build;
Applicaton: Industrial PCB PCBA;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Supplier Name

Shenzhen Zhendatech Co., Ltd.

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier