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US$1.00-10.00 / Square Meter

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What is China Directly Manufacturer One-Stop Quick Turn PCB Assembly Supplier

Name: China Directly Manufacturer One-Stop Quick Turn PCB Assembly Supplier
Uploaded: 2023-11-17T10:06:22+08:00
Description: 1.Company Profile ZINPON PCB is a leading manufacturer of high-density multi layer PCBs with more than ten years experience. 60% products are sold to Europe, America, Japan and other Asia-pacific cou

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Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Nelco Arlon Isola
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Organic Resin
Brand Zinpon Electronics
Transport Package Vacuum Package with Desiccant and Humidity Cards
Specification 650mm*1200mm
Trademark Customized
Origin China
Surface Treatment Enig2u′
Soldermask Customized
Customization Available
Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

1.Company Profile ZINPON PCB is a leading manufacturer of high-density multi layer PCBs with more than ten years experience. 60% products are sold to Europe, America, Japan and other Asia-pacific countries. The high quality of our products and short lead time brought us reputation and recognition ...

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Shenzhen Zinpon Electronics Co, Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products Printed Circuit Boards, PCBA, Industry Magnets Material Supply
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

OEM Comparison

	Quick View China Directly Manufacturer One-Stop Quick Turn PCB Assembly Supplier Contact Now	Quick View Shengyi Material S1000h 2.0mm HDI PCB Enig for Telecom Servers Contact Now	Quick View Telecom Light Template High Density Interconnect 8layer It180A Plated Gold PCB Contact Now	Quick View Telecom Backplane HDI 16layer S1000h 4.0mm Immersion Sn PCB Contact Now	Quick View Communication Module GPRS HDI 4layer Em825 Enig OSP PCB Contact Now

Transaction Info
	Quick View China Directly Manufacturer One-Stop Quick Turn PCB Assembly Supplier Contact Now	Quick View Shengyi Material S1000h 2.0mm HDI PCB Enig for Telecom Servers Contact Now	Quick View Telecom Light Template High Density Interconnect 8layer It180A Plated Gold PCB Contact Now	Quick View Telecom Backplane HDI 16layer S1000h 4.0mm Immersion Sn PCB Contact Now	Quick View Communication Module GPRS HDI 4layer Em825 Enig OSP PCB Contact Now
Price	US $ 1.00-10.00/ Square Meter	US $ 1.05-7.63/ Piece	US $ 0.895-5.88/ Piece	US $ 5.39-27.66/ Piece	US $ 0.22-1.15/ Piece
Min Order	1 Square Meters	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	UL#ISO9001#ISO45001#IATF16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Nelco Arlon Isola; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Zinpon Electronics; Surface Treatment: Enig2u'; Soldermask: Customized; Customization: Available;	Structure: Fr4 Shengyi Material; Dielectric: Fr4 S1000h 2.0mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Min. Hole Wall Cu: 25um;	Structure: Fr4 Tg180; Dielectric: Fr4 It180A 1.0mm; Material: Epoxy Paper Laminate; Application: Telecom; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 8layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Specialty: Plated Gold+Gold Fingers;	Structure: Fr4 Tg180; Dielectric: Fr4 S1000h 4.0mm; Material: Epoxy Paper Laminate; Application: Telecom; Flame Retardant Properties: V0; Processing Technology: Immersion Sn; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 16layer HDI PCB; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Min. Hole Wall: 25um Cu;	Structure: Multilayer Rigid PCB; Dielectric: Fr4 Em825 0.6mm; Material: Epoxy Paper Laminate; Application: Telecom; Flame Retardant Properties: V0; Processing Technology: Immersion Gold + OSP; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 4layer HDI PCB; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Feature: Half of Holes;
Supplier Name	Shenzhen Zinpon Electronics Co, Ltd	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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