Rigid Circuit Board

US$1.00-10.00 / Piece

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Hot Sell Electronic PCB Circuit Board Single Layer Main Board for Radio Device pictures & photos

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What is Hot Sell Electronic PCB Circuit Board Single Layer Main Board for Radio Device

Name: Hot Sell Electronic PCB Circuit Board Single Layer Main Board for Radio Device
Uploaded: 2023-11-24T15:50:12+08:00
Description: Company Profile Shenzhen ZINPON Electronics Co., Ltd One-Stop Services Of Custom PCB Manufacturing,PCB Assembly and Electronic Components Sourcing PCB Manufacture From prototype circuit boards to ma

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$1.00-10.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Organic Resin
Transport Package Vacuun Packing
Specification 650*1200mm
Trademark ZINPON
Origin China
Surface Treatment Enig
Raw Material Supplier Shengyi, Isola
Thick Hard Gold Plating Available
PCB Layout Available

Product Description

Company Profile Shenzhen ZINPON Electronics Co., Ltd One-Stop Services Of Custom PCB Manufacturing,PCB Assembly and Electronic Components Sourcing PCB Manufacture From prototype circuit boards to massproduction,from fast turn to stardard deliverytime, ZINPON is your reliable PCB ...

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Shenzhen Zinpon Electronics Co, Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products Printed Circuit Boards, PCBA, Industry Magnets Material Supply
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Rigid Circuit Board Comparison

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Transaction Info
	Quick View Hot Sell Electronic PCB Circuit Board Single Layer Main Board for Radio Device Contact Now	Quick View King Field/OEM Copper Vacuum Packaging 100*585 China CCTV PCB Board Contact Now	Quick View ± 8% Electrolytic Foil King Field/OEM Vacuum Packaging Copper Clad Laminate PCB Contact Now	Quick View Fr-4 King Field/OEM Vacuum Packaging Copper Sheet Rigid PCB Circuit Boards Contact Now	Quick View Copper Electrolytic Foil King Field/OEM Vacuum Packaging Al Base Ccl PCB Board Contact Now
Price	US $ 1.00-10.00/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	-	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS
Management System Certification	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Surface Treatment: Enig; Raw Material Supplier: Shengyi, Isola; Thick Hard Gold Plating: Available; PCB Layout: Available;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;
Supplier Name	Shenzhen Zinpon Electronics Co, Ltd	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)
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