What is Surface Mount Technology for Energy Storage

Name: Surface Mount Technology for Energy Storage
Uploaded: 2023-12-11T20:22:19+08:00
Description: 1. Company Profile Get ready to experience the cutting-edge world of high-density multi layer PCBs with ZINPON PCB! With over ten years of expertise, we are a leading manufacturer that has captured t

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Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Organic Resin
Brand Zinpon Electronics
Transport Package Vacuum Package with Desiccant and Humidity Cards
Specification 650mm*1200mm
Trademark Customized
Origin China
Surface Treatment Enig2u′
Soldermask Customized
Customization Available
Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

1. Company Profile Get ready to experience the cutting-edge world of high-density multi layer PCBs with ZINPON PCB! With over ten years of expertise, we are a leading manufacturer that has captured the hearts of English-speaking natives worldwide. Our top-notch products have gained a reputation ...

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Shenzhen Zinpon Electronics Co, Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products Printed Circuit Boards, PCBA, Industry Magnets Material Supply
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Energy Storage Surface Mount Technology Comparison

	Quick View Surface Mount Technology for Energy Storage Contact Now	Quick View Rigid-Flex Board PCB RoHS Medical Flex Printed Circuit Board PCB Ceramic Finger Surface Packing Ray Solder RoHS PCB Assembly Contact Now	Quick View Prototype Double Side Print Circuit Board Gold Fingers Customization PCB Contact Now	Quick View SMD LED Printed Circuit Board Contact Now	Quick View High Quality LED Printed Circuit Board Manufacture Contact Now

Transaction Info
	Quick View Surface Mount Technology for Energy Storage Contact Now	Quick View Rigid-Flex Board PCB RoHS Medical Flex Printed Circuit Board PCB Ceramic Finger Surface Packing Ray Solder RoHS PCB Assembly Contact Now	Quick View Prototype Double Side Print Circuit Board Gold Fingers Customization PCB Contact Now	Quick View SMD LED Printed Circuit Board Contact Now	Quick View High Quality LED Printed Circuit Board Manufacture Contact Now
Price	US $ 1.00-10.00/ Square Meter	US $ 0.01-20.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	1 Square Meters	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW	FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Payment Terms	T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	UL#ISO9001#ISO45001#IATF16949	-	-	RoHS, UL, SGS, Ect	RoHS, UL, SGS, Ect
Management System Certification	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM	OEM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Zinpon Electronics; Surface Treatment: Enig2u'; Soldermask: Customized; Customization: Available;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Medical Instruments; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Use: Medical Device, Machine, Commication;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Aerospace; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Layer Counts: 1-20 Layers; Board Thickness: 0.20mm-8.00mm; Maximum Size: 600mmx1200mm; Insulation Layer Thickness: 0.075mm--5.00mm; Minimum Line: 0.075mm; Minimum Space: 0.075mm; out Layer Copper Thickness: 18um--350um; Inner Layer Copper Thickness: 17um--175um; Diameter Tolerance(Mechanical): 0.05mm;	Structure: Single-Sided Rigid PCB; Dielectric: Al; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: OSP; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: White; Size: 6656mm;* Package: Vacuum;	Structure: Single-Sided Rigid PCB; Dielectric: Al; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: OSP; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: White; Size: 6656mm;* Package: Vacuum;
Supplier Name	Shenzhen Zinpon Electronics Co, Ltd	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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