PCB Manufacturing
US$1.00-10.00 / Square Meter
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What is FPC Multilayer PCB Board Manufacturer in China Lead-Free ISO Automotive Electronics Motherboard

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

  • Structure Multilayer FPC
  • Material Polyester Film
  • Combination Mode Adhesive Flexible Plate
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Zinpon Electronics
  • Transport Package Vacuum Package with Desiccant and Humidity Cards
  • Specification 650mm*1200mm
  • Trademark Customized
  • Origin China
  • Surface Treatment Enig2u′
  • Soldermask Customized
  • Customization Available
  • Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

1.Company Profile ZINPON PCB is a leading manufacturer of high-density multi layer PCBs with more than ten years experience. 60% products are sold to Europe, America, Japan and other Asia-pacific countries. The high quality of our products and short lead time brought us reputation and recognition ...

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PCB Manufacturing Comparison
Transaction Info
Price US $ 1.00-10.00/ Square Meter US $ 0.01-10.00/ Piece US $ 0.15-20.00/ Piece US $ 1/ Piece US $ 0.01-50.00/ pcs
Min Order 1 Square Meters 1 Pieces 1 Pieces 200 Pieces 1 pcs
Trade Terms - - - - -
Payment Terms T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, Western Union, Paypal L/C, T/T, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net
Quality Control
Product Certification UL#ISO9001#ISO45001#IATF16949 - - - -
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 - ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM OEM - OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Zinpon Electronics;
Surface Treatment: Enig2u';
Soldermask: Customized;
Customization: Available;
Structure: 1-8 Layers FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 1-8 Layers;
Raw Material: Aluminum Base, Copper Base;
Min Hole Size: 12mil(0.3mm);
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Surface Finishing: HASL-Lf, Immersion Gold(Enig), Immersion Sliver,;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
OEM: Yes;
Mqq: 10000;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 1-8 Layers;
Board Thickness: 0.2mm;
Copper Thickness: 35um;
Surface Finish: Immersion Gold;
Solder Mask: Coverlay;
Supplier Name

Shenzhen Zinpon Electronics Co, Ltd

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Jinjiang Chaote Co., Ltd.

China Supplier - Diamond Member

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier