Capacitor Supplier for PCB Design and Assembly Service

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Zinpon Electronics
  • Transport Package Vacuum Package with Desiccant and Humidity Cards
  • Specification 650mm*1200mm
  • Trademark Customized
  • Origin China
  • Surface Treatment Enig2u′
  • Soldermask Customized
  • Customization Available
  • Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

Welcome to ZINPON PCB, your leading manufacturer of high-density multi-layer PCBs! Get ready to be amazed by our cutting-edge technology and top-notch products. With over ten years of experience, we have earned a stellar reputation worldwide, including in Europe, America, Japan, and other ...

Learn More

Capacitor Supplier Comparison
Transaction Info
Price US $ 1.00-10.00/ Square Meter US $ 0.885-6.29/ Piece US $ 0.523-2.79/ Piece US $ 0.683-2.94/ Piece US $ 2.87-9.92/ Piece
Min Order 1 Square Meters 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification UL#ISO9001#ISO45001#IATF16949 - - - -
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Zinpon Electronics;
Surface Treatment: Enig2u';
Soldermask: Customized;
Customization: Available;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Security PCB;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 10L up to 20L;
Board Thickness: 1.6mm up to 8mm;
Min Hole Size: 0.25mm;
Min. Trace/Space: 4mil;
Finished Copper: 1/1 Oz;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Security PCB;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 8L up to 20L;
Board Thickness: 1.6mm up to 8mm;
Min Hole Size: 0.25mm;
Min. Trace/Space: 4mil;
Finished Copper: 1/1 Oz;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Security PCB;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 8L up to 24L;
Board Thickness: 1.6mm up to 8mm;
Min Hole Size: 0.25mm;
Min. Trace/Space: 4mil;
Finished Copper: 1/1 Oz;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Security PCB;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 10L up to 24L;
Board Thickness: 1.6mm up to 8mm;
Min Hole Size: 0.25mm;
Min. Trace/Space: 4mil;
Finished Copper: 1/1 Oz;
Supplier Name

Shenzhen Zinpon Electronics Co, Ltd

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier