Tailored Soldermask
US$1.00-10.00 / Square Meter
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What is Tailored Soldermask for Pcbs

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Nelco Arlon Isola
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Zinpon Electronics
  • Transport Package Vacuum Package with Desiccant and Humidity Cards
  • Specification 650mm*1200mm
  • Trademark Customized
  • Origin China
  • Surface Treatment Enig2u′
  • Soldermask Customized
  • Customization Available
  • Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

1. Company Profile Welcome to ZINPON PCB, a leading manufacturer of high-density multi-layer PCBs with over a decade of experience. Our commitment to excellence has earned us a reputation and recognition worldwide. With 60% of our products sold to Europe, America, Japan, and other Asia-Pacific ...

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Tailored Soldermask Comparison
Transaction Info
Price US $ 1.00-10.00/ Square Meter US $ 0.01-150.00/ Piece US $ 0.01-150.00/ Piece US $ 0.01-150.00/ Piece US $ 0.01-150.00/ Piece
Min Order 1 Square Meters 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification UL#ISO9001#ISO45001#IATF16949 - - - -
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Nelco Arlon Isola;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Zinpon Electronics;
Surface Treatment: Enig2u';
Soldermask: Customized;
Customization: Available;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: N/a;
Board Thickness: 1.6 mm;
Surface: Immersion Gold 2u'';
Solder Mask: Black;
Outer Copper: 2oz;
Inner Copper: 1oz;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: N/a;
Board Thickness: 3.2 mm;
Surface: Gold Plating 30u'';
Solder Mask: Green;
PCB Material: Fr4;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Board Thickness: 3.2 mm;
Solder Mask: Yellow Green;
Material Type: Fr4, Alu;
Thermal Conductivity: 3W;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Board Thickness: 1.6 mm;
Solder Mask: Green;
Layer: 1 Layer-20 Layer;
Min.Hole Size: 0.1mm (Drilling Hole);
Supplier Name

Shenzhen Zinpon Electronics Co, Ltd

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier