Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Zitrok;
Soldermask Color: Red, Blue, Purple, Green, Black, White;
Quality Assurance: UL, ISO9001, 100% E-Test, Aoi, RoHS;
MOQ: No MOQ, 1PCS Is Okay;
Stock Material: Shengyi, Fr4,Pi,Alu,Rogers, Arlon, Taconic, Isola;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Special: Impedance Control;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Material: Fr4-S1000-2;
Application: Security Engineer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 5mil/4mil;
Special: Balck Printing Ink, Impedance;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Material: Fr4-S1000-2m;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Lead HASL;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 2oz/2oz;
Min Trace Width/Spacing: 12mil/12mil;
Special: Automative Power Supply, High Reliability;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Mini Hole Diameter: 0.5mm;
Borad Thickness: 1.6mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 12mil/12mil;
Special: High Reliability;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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