Multilayer PCB Immersion Gold 8 Layer PCB, Electronics Printed Circuit Board with UL Certification

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Phenolic Paper Laminate
  • Application Aerospace
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Zitrok
  • Transport Package Vacuum Packing, Foam Protection, Carton Packing
  • Specification Blind & Buried Vias/Resin Plugged Vias/Gold Finger
  • Trademark Zitrok
  • Origin China
  • Quality Assurance UL, Aoi, RoHS, ISO9001, 100% E-Test
  • Material Stock Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic
  • MOQ 1PCS Is Okay

Product Description

About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: Multilayer PCB Immersion Gold 8 Layer PCB, Electronics Printed Circuit Board with UL Certification Quick-turn pcb service provided. Layer Samples Prototype Quick-turn Volume 2 5 WD 24 Hours - ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.1/ Piece US $ 1/ Piece US $ 1/ Piece US $ 0.20-0.60/ Piece US $ 0.60-1.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - FOB, DDP, DAP FOB, DDP, DAP FOB, CFR, CIF, DDP, DAP, EXW FOB, CIF, DAT, FAS, DDP, DAP, CIP, FCA, EXW
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T L/C, T/T L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test;
Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
MOQ: 1PCS Is Okay;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 4;
Thickness: 0.55mm;
Hole: 0.3mm;
Surface: Enig;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 4;
Thickness: 0.4mm;
Surface: Enig;
Space: 0.12mm;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finish: Enig/1u'';
Layer: 1-24;
Base: Fr-4 (Tg110-180), Rogers, Shenyi;
Material Finished Thickness: 0.2-5.0mm;
Finished Copper Thickness: 1oz;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 8 Working Days;
Fast Turn: 3 Working Days;
Structure: Multilayer Rigid PCB;
Dielectric: High Frequency;
Material: Epoxy Glass;
Application: Industrial Control;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Finished Product;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customerised;
Surface Finihsing: Immersion/ Chemical Gold 3u'';
Array Size: 260.2*215.55mm;
Min Copper Clearance: 100um;
Supplier Name

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier