Silicon Wafer Grinding Wheel

US$1,500.00-2,500.00 / Piece

Semiconductor Silicon Wafer Back Grinding Wheel for Precision Chip Processing pictures & photos

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What is Semiconductor Silicon Wafer Back Grinding Wheel for Precision Chip Processing

Name: Semiconductor Silicon Wafer Back Grinding Wheel for Precision Chip Processing
Uploaded: 2025-05-09T11:21:20+08:00
Description: About us Hongtuo can provide a full range of CBN and diamond honing stones, honing tools, CBN and diamond grinding wheels, diamond dicing blades,diamond rotary dressers and other super abrasives tools

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Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$2,500.00

10-99 Pieces US$2,000.00

100+ Pieces US$1,500.00

Sepcifications

Type Thinning
Material Imported Diamond Abrasive
Application Deburring, Ferrous Metals
Transport Package Wooden Boxes
Specification JB
Trademark HT
Origin Henan, China
Viscosity Customized
Grit Size (JIS) 80#---1000#
Shape Cylindrical
Warranty 1 Years
Service 7 Days/24 Hours
Feature Long Life
Grinding Material Cubic Boron Carbide
Customized Support OEM, ODM
Bonding Agent Vitrified & Resin
Product Name Diamond Grinding Wheel
Package Wooden Box
Wheel Type Angle Grinding Wheels
Bond Vitrified & Resin
Wheel Base Steel

Product Description

About us Hongtuo can provide a full range of CBN and diamond honing stones, honing tools, CBN and diamond grinding wheels, diamond dicing blades,diamond rotary dressers and other super abrasives tools. These products are widely used in automotives, motorcycles, aerospace, refrigerator compressor, ...

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Zhengzhou Hongtuo Precision Tools Co., Ltd.

Gold Member Since 2024

Audited Supplier

Rating & Reviews: 5.0/5.0

(20 Reviews)

Business Type Manufacturer/Factory & Trading Company
Main Products Honing Tools, Grinding Wheels
Number of Employees 296
Year of Establishment 2014-06-06
Management System Certification ISO9001:2015, ISO14001:2015
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

Silicon Wafer Grinding Wheel Comparison

	Semiconductor Silicon Wafer Back Grinding Wheel for Precision Chip Processing Contact Now	Quick View Cutting Tool Antislip Whetstone Sharpening Stone Contact Now	Quick View Factory Outlet Sharpening Stone with Double-Sided Dimension Have Non-Slip Rubber Pad Contact Now	Quick View 600/800/1500/3200/4000/6000/8000 Grit Knife Sharpening Stone Whestone / Cutting Tool Contact Now	Quick View Factory Outlet Double-Sided Size 600-3000 Grit Whetstone with Rubber Mat Contact Now

Transaction Info
	Semiconductor Silicon Wafer Back Grinding Wheel for Precision Chip Processing Contact Now	Quick View Cutting Tool Antislip Whetstone Sharpening Stone Contact Now	Quick View Factory Outlet Sharpening Stone with Double-Sided Dimension Have Non-Slip Rubber Pad Contact Now	Quick View 600/800/1500/3200/4000/6000/8000 Grit Knife Sharpening Stone Whestone / Cutting Tool Contact Now	Quick View Factory Outlet Double-Sided Size 600-3000 Grit Whetstone with Rubber Mat Contact Now
Price	US $ 1,500.00-2,500.00/ Piece	US $ 2.30-2.50/ Piece	US $ 2.30-2.50/ Piece	US $ 2.30-2.50/ Piece	US $ 2.30-2.50/ Piece
Min Order	1 Pieces	1000 Pieces	1000 Pieces	1000 Pieces	1000 Pieces
Payment Terms	T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	-	ISO 9001, ISO 14001, ISO 20000	ISO 9001, ISO 14001, ISO 20000	ISO 9001, ISO 14001, ISO 20000	ISO 9001, ISO 14001, ISO 20000
Trade Capacity
Export Markets	-	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$2.5 Million - US$5 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	-	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month
Product Attributes
Specification	Type: Thinning; Material: Imported Diamond Abrasive; Application: Deburring, Ferrous Metals; Viscosity: Customized; Grit Size (JIS): 80#---1000#; Shape: Cylindrical; Warranty: 1 Years; Service: 7 Days/24 Hours; Feature: Long Life; Grinding Material: Cubic Boron Carbide; Customized Support: OEM, ODM; Bonding Agent: Vitrified & Resin; Product Name: Diamond Grinding Wheel; Package: Wooden Box; Wheel Type: Angle Grinding Wheels; Bond: Vitrified & Resin; Wheel Base: Steel;	Type: Standard Oilstone; Material: White Corundum; Application: Tool; Effect: Grinding;	Type: Standard Oilstone; Material: White Corundum; Application: Tool; Effect: Grinding;	Type: Standard Oilstone; Material: White Corundum; Application: Tool; Effect: Grinding;	Type: Standard Oilstone; Material: White Corundum; Application: Tool; Effect: Grinding;
Supplier Name	Zhengzhou Hongtuo Precision Tools Co., Ltd.	QINGDAO ZONGYU INDUSTRY AND TRADE CO., LTD.	QINGDAO ZONGYU INDUSTRY AND TRADE CO., LTD.	QINGDAO ZONGYU INDUSTRY AND TRADE CO., LTD.	QINGDAO ZONGYU INDUSTRY AND TRADE CO., LTD.
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