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Enig Immersion Gold 6 Layers Circuit Board Fr4 PCB Leading Manufacturer Multiplayer PCB for Communication pictures & photos

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What is Enig Immersion Gold 6 Layers Circuit Board Fr4 PCB Leading Manufacturer Multiplayer PCB for Communication

Name: Enig Immersion Gold 6 Layers Circuit Board Fr4 PCB Leading Manufacturer Multiplayer PCB for Communication
Uploaded: 2023-10-18T11:17:33+08:00
Description: Enig Immersion Gold 6 Layers Circuit Board Fr4 PCB Leading Manufacturer Multiplayer PCB for Communication 1. Single, Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hol

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.0001-99.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Industry Control Module
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification 1 Pieces/Panel
Origin Shenzhen, China
Layers 6 Layers
Thickness 1.5mm
Solder Mask Green
Legend White
Surface Finish Enig

Product Description

Enig Immersion Gold 6 Layers Circuit Board Fr4 PCB Leading Manufacturer Multiplayer PCB for Communication 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

Integrated Circuits Comparison

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Transaction Info
	Quick View Enig Immersion Gold 6 Layers Circuit Board Fr4 PCB Leading Manufacturer Multiplayer PCB for Communication Contact Now	Quick View Ten Multilayer PCB OSP Motherboard for Cellphones with Immersion Gold Contact Now	Quick View Double Multilayer PCB Board for High Voltage Power Supply Industrial Instruments with Immersion Gold Contact Now	Quick View Four Multilayer PCB Board for Digital Camera SLR Lens with Immersion Gold Contact Now	Quick View Four Multilayer PCB HDI Board for Consumers Electronics Contact Now
Price	US $ 0.0001-99.00/ Piece	US $ 3.91-3.92/ Piece	US $ 3.91-3.92/ Piece	US $ 3.91-3.92/ Piece	US $ 3.91-3.92/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	T/T	T/T	T/T	T/T
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	-	-	-
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Industry Control Module; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layers: 6 Layers; Thickness: 1.5mm; Solder Mask: Green; Legend: White; Surface Finish: Enig;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;
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