| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb;
Cooper Thickness: 1oz;
Surface Finishing: Lead Free HASL;
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.075mm/0.075mm;
Min Hole Diameter: 0.15mm;
Finished Board Thickness: 1.6 mm;
Layer: 2layer;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: ODM;
Item: Infrared Temperature Automatic Soap Dispenser;
Temperature Unit: Celsius / Fahrenheit;
Precision: +/-0.2 Degree;
Function: Body/Object Temperature/Counting Number;
Keyword: Sensor Hand Sterilizer Dispenser;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Ain;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aln, Al2O3;
Insulation Materials: Aln, Al2O3;
Model: PCB;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: Enig, Enepig, Immersion Silver;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Outline Tolerance(mm): 0.05mm;
Hole Tolerance: 0.05mm;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Ain;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aln, Al2O3;
Insulation Materials: Aln, Al2O3;
Model: PCB;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: Enig, Enepig, Immersion Silver;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Outline Tolerance(mm): 0.05mm;
Hole Tolerance: 0.05mm;
|
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Ain;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Ain, Al2O3;
Insulation Materials: Ain, Al2O3;
Model: PCB;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: Enig, Enepig, Immersion Silver;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Outline Tolerance(mm): 0.05mm;
Hole Tolerance: 0.05mm;
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