1,182 Aln Aluminum Nitride Ceramic Substrate
results from27 suppliers
High Thermal Conductivity Aln Ceramic Substrate High Purity Customized Aln Substrate Aluminum Nitride Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Customized High Quality Aln Thin Sheet Aluminium Nitride Ceramic Substrate Plate for Industy Use
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Customized Aln Aluminum Nitride Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
High Durability Aln Aluminium Nitride Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Laser Scribing Aln Ceramic Base PCB Heatsink Aluminium Nitride Substrate
- Application: Industrial Ceramic
- Type: Ceramic Plates
- Forming Method: Tape Casting
- Features: High Thermal Conductivity, Cte Matching Si
- Density: Over 3.33G/Cm3
- Standard Thickness: 0.1-3mm Available
Customized 170W Aln Slice Aluminum Nitride Ceramic Substrate for High-Frequency Equipment
- Application: Industrial Ceramic
- Type: Ceramic Plates
- Thermal Conductivity: 170W/Mk (at 20 Degree )
- Tolerance: +-0.05mm
- Surface Roughness: Ra 0.2 -05 Um
- Max Working Temperature: 2200 Degree
Bare Aln Aluminium Nitride Ceramic Substrate For Power Electronics
- Application: Electronics, Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Mirror Polishing Fine Grinding Aluminum Nitride Aln Ceramic Substrate PCB
- Structure: Ceramic Base PCB
- Dielectric: AIN
- Material: Aluminum Nitride Ceramic
- Application: Bare Ceramic Circuit Board
- Base Material: Aluminum Nitride Ceramic
- Insulation Materials: Aluminum Nitride Ceramic
Wholesale Aluminum Nitride Thermal Conductive Plate Electrical Insulation Heat Sink Sheet High Purity Aln Ceramic Substrate
- Application: Structure Ceramic, Industrial Ceramic
- Type: Ceramic Plates
- Name: Wholesale Aluminum Nitride Thermal Conductive Plat
- Color: Grey
- Working Temperature: 850°c
- Density: 3.30 g/cm3
Ultra-Thin Aln Sheet High Temperature Aluminum Nitride Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Suoyi High Purity Aluminum Nitride Aln for Ceramic Substrate
- Application: Ceramic Decorations, Refractory, Industrial Ceramic
- Type: Aluminum Nitride Powder
- Particle Size: 5um 10um
- Purity: 99.8% 99.99%
- Appearance: White or off-White Powder
- Nature: Atomic Crystal
as Fired High Thermal Conductivity Aln Aluminum Nitride Ceramic Substrate
- Application: Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic
- Type: Ceramic Plates
- Forming Method: Tape Casting
- Features: High Thermal Conductivity, Cte Matching Si
- Usage: Blank Ceramic Circuit Board
- Density: Over 3.33G/Cm3
Insulated Heat Sink Grey Aln Aluminum Nitride Ceramic Substrate Sheet
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Customization Thickness Aluminum Nitride Rectangular Aln Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
OEM Aln/Aluminum Nitride Ceramics Substrate and Plate
- Type: Industrial
- Material: Ceramics
- Raw Material: Aln
- Technique: Pressure
- Theme: Industrial
- Style: Classical
Aln Aluminum Nitride Ceramic Substrate, Industrial Ceramics, Structure Ceramic Products
- Refractoriness (℃): 1580< Refractoriness< 1770
- Feature: Long Time Materials
- Type: Heat-Resistant Material
- Shape: Plate
- Material: Alumina Block
- Max Working Temperature: 1600c
High Thermal Conductivity Polished Aln Wafer Aluminum Nitride Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Customized High Quality Aln Thin Sheet Aluminium Nitride Ceramic Substrate for Industy Use
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Heat Dissipation Substrate in Electrical Applications170W-220W 0.635mm Aln Aluminium Nitride Ceramic Substrate for Heat Sink
- Application: Structure Ceramic, Industrial Ceramic
- Type: Ceramic Plates
- Product Name: High Precision Aluminium Nitride Ceramic Sheet
- Color: Brown
- Density: 3.2g/cm3
- Thermal Conductivity: 170-220W
Customized High Accuracy Aln Aluminum Nitride Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
High Mechanical Resistance Aln Aluminium Nitride Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Electrical Insulating Capacity Aln Aluminium Nitride Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
0.38mm 0.5mm 0.635mm 1mm Aluminum Nitride Rectangular Aln Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Customized High Thermal Conductivity Aln Sheet Aluminum Nitride Ceramic Substrate for Industrial Electronic Application
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Customize Aluminium Nitride/Aln Ceramic Substrate for Semiconductors High Thermal Conductivity
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Aln Aluminum Nitride Ceramic Substrate for Power Electronic Device
- Application: Refractory, Structure Ceramic, Industrial Ceramic, Semiconductor
- Type: Ceramic Plates
- Product Name: Aluminum Nitride Substrate
- Color: Grey, or Black
- MOQ: 1PCS Per Order
- Dimensions: as Per Customer Requirement
Unfired Aln Aluminium Nitride Ceramic Substrate for Electronics
- Application: Electronics, Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Laser Cutting Scribing Aln Blank Ceramic Substrate Aluminum Nitride PCB
- Dielectric: AIN
- Forming Method: Tape Casting
- Features: High Thermal Conductivity, Cte Matching Si
- Usage: Bare Ceramic Circuit Board
- Optional Color: Gray, Ivory
- Density: Over 3.33G/Cm3
Customized 0.635mm Solder PCB DCP Track Design Aln Aluminum Nitride Ceramic Substrate with Copper
- Application: Structure Ceramic, Industrial Ceramic
- Type: Ceramic Plates
- Product Name: Track Design Aln Aluminum Nitride Ceramic Substra
- Feature: Good Thermal Conductivity
- Density(g/cm3): 3.3G/Cm3
- Dielectric Strength: ≥15kv/mm
China Aln High Purity Nitride Aluminum Powder, Aluminium CAS 24304-00-5 Molecular Weight 40.99 Metal Aluminum Nitride Powder Used in Ceramic Substrate
- Application: Ceramic Decorations, Refractory, Industrial Ceramic
- Type: Aluminum Nitride Powder
- Particle Size: 5um 10um
- Purity: 99.8% 99.99%
- CAS: 24304-00-5
- Name: Aluminum Nitride
Aln/Aluminum Nitride Ceramics Substrate and Plate
- Type: Industrial
- Material: Ceramics
- Raw Material: Aln
- Technique: Pressure
- Theme: Industrial
- Style: Classical
Silver Firing Process Metallization of Aluminum Nitride Aln Ceramic Substrate
- Application: Structure Ceramic, Industrial Ceramic
- Type: Ceramic Plates
- Finished Product: Ceramic Circuit Board
- Surface Metallization Process: Silver Firing Process
- Feature: Excellent Electrical and Thermal Properties
- Usage: to Realize Electrical Connections
Customized High Quality Copper Plating Aln Thin Sheet Aluminium Nitride Ceramic Substrate for Industy Use
- Application: Industrial Ceramic
- Type: Ceramic Plates
- Name: Customized High Quality Copper Plating Aln Thin Sh
- Color: Grey
- Working Temperature: 850°c
- Density: 3.30 g/cm3
High Bonding Strength Alumina Circuit Board Aluminum Nitride Aln Metallized Ceramic Substrate
- Application: Structure Ceramic, Industrial Ceramic
- Type: Ceramic Plates
- Finished Product: Ceramic Circuit Board
- Substrate Material: 96%, 99.6% Alumina or Aln
- Usage: to Realize Electrical Connections
- Feature: Strong Bonding Strength Between Ceramic and Metal
High Chemical Resistance Aln Aluminium Nitride Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Aln Aluminium Nitride Ceramic Substrate Plate Sheet
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Aluminum Nitride Aln Ceramic Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Customized Insulation Aluminium Nitride Aln Ceramic Substrate for LED Circuit Board
- Application: Industrial Ceramic
- Type: Ceramic Substrate
- Name: Aluminium Nitride Ceramic Substrate
- Size: Customized
- Appearance: Neat
- Shape: Customized
Aln Aluminum Nitride Ceramic Plate Substrate
- Application: Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plate, Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz
Unfired Aln Aluminium Nitride Ceramic Substrate For Power Electronics
- Application: Electronics, Industrial Ceramic, Electronic Ceramic
- Type: Ceramic Plates
- Lead Time: 30 Days
- Density: 3.33G/Cm^3
- Thermal Conductivity: >180/25ºCw/(Mk)
- Dielectric Constant: 8.8/1MHz