418 Bga Reballing
results from10 suppliers
Precision BGA Rework/BGA Testing Service/BGA IC Rework, BGA Reball/Reballing
- Pacakge: BGA
- No. of Pins: 1~2999
- Pitch: 0.3mm or Above
- Application: BGA Reballing
- Technical Support: Yes
- OEM: Acceptable
Pop BGA Reballing for Msm8976/Msm8996/Mt6797/Mt6595/Mt6970
- OEM: Acceptable
- Packing: Carton Box
- Standard: BGA
- Port: Shenzhen
- Production Capacity: 20000PCS/Week
- Trademark: various
T-890I BGA Rework Station Reballing Machine for Laptop Motherboard Repair
- Power: 1500W
- Packing: 1PC/Carton
- Standard: CE
- Port: Qingdao
- Production Capacity: 600PCS/Month
- Trademark: PUHUI
T-890 Infrared BGA Rework Station, New BGA Reballing Machine
- Power: 1500W
- Packing: 1PC/Carton
- Standard: CE
- Port: Qingdao
- Production Capacity: 600PCS/Month
- Trademark: Puhui
Infrared BGA Machine Reballing with Solder Iron and Laser Positioning for All of Motherboard Repairing
- Product Name: Infrared BGA Reballing Machine
- Total Power: 4900W
- Top Hot Air Heating: 800W
- Bottom Heating: Bottom Hot Air Heating 1200W, IR Preheating 2700W
- Power: 110V/220V(Optional)
- Temperature Accuracy: +/- 2 ºC
Wds -620 BGA Reballing Machine BGA Rework System for Laptop Mobile Car Ship Motherboard Repair Machine
- Type: Welding Manipulator
- Structure: Platform
- Rotaion Speed: 0.05-0.5rpm
- Max Eccentricity Distance: 100mm
- Tilting Angle: 0-45
- Voltage: 110V/220V
Wds580 BGA SMD IC Chip Rework Reballing Station Repair Mobile Latlops PS4 Machine Tool
- Type: Welding Manipulator
- Structure: Platform
- Rotaion Speed: 0.1-1rpm
- Max Eccentricity Distance: 150mm
- Tilting Angle: 0-135°
- Voltage: 110V/220V
BGA Reballing Stencil with 501 PCS (80mm*80mm)
- HS Code: 854231000
Reflow Oven Soldering Station Puhui T-962A+ Lead-Free Reflow Solder Oven BGA SMD SMT with 110 Volt
- Packing Size: 55*50*35cm
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350
- Gross Weight: 17.5kg
- Max Soldering Area: 450*370mm
Reflow Oven,8 Intelligent Temperature Waves Heating,Desktop Reflow Oven,Infrared Reflow Oven,BGA IrDA Welder,SMT Reflow Oven,Infrared IC Heater Puhui T962A
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
SMT Reflow Oven, 962A BGA Rework System, Soldering Machine, Infrared Reflow Oven, Desktop Reflow Oven Puhui T962A
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
Infrared Reflow Oven, Wave Soldering Machine, Desktop Reflow Oven, Infrared Reflow Oven, BGA IrDA Welder, SMT Reflow Oven, Infrared IC Heater Puhui T962A
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
Puhui Laptop BGA Rework Station T-890 with 8 Intelligent Curves
- Power: 1500W
- Packing: 1PC/Carton
- Standard: CE
- Port: Qingdao
- Production Capacity: 600PCS/Month
- Trademark: Puhui
PCB Soldering Machine, T962A Reflow Oven, Puhui T962A, BGA Reballing, Reflow Solder
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
Infrared BGA Rework Station, Mobile Phone Rework Station T862
- Type: Soldering Station
- Structure: Gantry
- Rotaion Speed: 0.3-3rpm
- Max Eccentricity Distance: 250mm
- Tilting Angle: 0-135°
- Voltage: 110V/220V
962A BGA Rework System, Soldering Machine, Infrared Reflow Oven, Desktop Reflow Oven Puhui T962A
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
BGA Reballing Welding Machine, Soldering Machine, BGA Repair, Rework Station T862++
- Type: Soldering Station
- Structure: Gantry
- Rotaion Speed: 0.3-3rpm
- Max Eccentricity Distance: 250mm
- Tilting Angle: 0-135°
- Voltage: 110V/220V
IrDA Welder, BGA Rework Station T-862, Reballing Tool
- Voltage: 110V/220V
- Color: Black
- Packing: Carton Size: 46*34*30.5cm
- Standard: 220v / 110v AC 50-60Hz
- Port: Qingdao
- Production Capacity: 300 PCS/Month
Puhui T-862++ BGA Infrared Soldering Desoldering Rework Station
- Type: Soldering Station
- Tilting Angle: 0-135°
- Voltage: 110V/220V
- Welding Turning Rolls Type: Channeling
- Condition: New
- Color: Black
370*450mm Solder Size Infrared Lead Free Desktop Reflow Oven Puhui T962A+
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350degrees
- Max Soldering Area: 450*370mm
- Dimensions: 52*44*22cm
- Power Voltage: AC 220V 50-60Hz
Lead-Free Desktop Reflow Oven Soldering Station Puhui T-962A+ for BGA Welding
- Packing Size: 55*50*35cm
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350
- Gross Weight: 17.5kg
- Max Soldering Area: 450*370mm
Reflow Oven Soldering Station Puhui T-962A+ Lead-Free Reflow Solder Oven BGA SMD SMT with 110 Volt for BGA Welding
- Packing Size: 55*50*35cm
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350
- Gross Weight: 17.5kg
- Max Soldering Area: 450*370mm
T-962A+ Reflow Oven, BGA Rework System, Infrared Reflow Oven
- Packing Size: 55*50*35cm
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350
- Gross Weight: 17.5kg
- Max Soldering Area: 450*370mm
T962A Reflow Oven, Desktop Reflow Oven, Infrared Reflow Oven, BGA IrDA Welder, SMT Reflow Oven, Infrared IC Heater Puhui T962A
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
Desktop Reflow Oven, Infrared Reflow Oven, BGA IrDA Welder, SMT Reflow Oven, Infrared IC Heater Puhui T962A
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
Reflow Oven, 8 Intelligent Temperature Waves Heating, Desktop Reflow Oven, Infrared Reflow Oven, BGA IrDA Welder, SMT Reflow Oven Puhui T962A
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
AC220V/110V Infrared IC Heater, T962A Reflow Oven, SMT Reflow Oven, PCB Soldering Machine, Wave Soldering Machine, BGA IrDA Welder, Desktop Reflow Oven
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
SMT Reflow Oven, Wave Soldering Machine, 962A BGA Rework System, Soldering Machine, Infrared Reflow Oven, Desktop Reflow Oven Puhui T962A
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
T962A Small Wave Soldering Machine, BGA Reflow Oven, Automatic Reflow Soldering Oven Machine, Taian, Puhui, Hot Air Reflow Oven
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
Puhui T-962A+, PCB Soldering Machine, Desktop Reflow Oven T962A+
- Packing Size: 55*50*35cm
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350
- Gross Weight: 17.5kg
- Max Soldering Area: 450*370mm
PCB Soldering Machine LED SMT Puhui Reflow Oven T-962A
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
Desktop Reflow Oven, Best Quality Reflow Oven, Wave Solder, Hot Air Reflow Oven, T962A Reflow Oven, PCB Soldering Machine, Hot Air Reflow Oven
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
Infrared Reflow Oven Soldering Station Reflow Solder T962A
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
PCB Soldering Machine, Reflow Oven T962A, Welding Machine, Soldering Machine
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
LED SMT Reflow Oven, Taian Puhui T-962A+
- Packing Size: 55*50*35cm
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350
- Gross Weight: 17.5kg
- Max Soldering Area: 450*370mm
T962A+ Reflow Oven Can Solder Most Boss Eyed or Double Face PCB Boards
- Packing Size: 55*50*35cm
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350
- Gross Weight: 17.5kg
- Max Soldering Area: 450*370mm
T962A Reflow Oven Manufacture, Desktop Reflow Oven, Soldering Machine, PCB Soldering Machine
- Packing Size: 51*44.5*33cm
- Rated Power: 1500W
- Process Period: 1--8min
- Temperature Range: 0-280
- Gross Weight: 15kg
- Max Soldering Area: 300*320mm
8 Intelligent Temperature Waves Heating T-962A+ Reflow Oven
- Packing Size: 55*50*35cm
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350
- Gross Weight: 17.5kg
- Max Soldering Area: 450*370mm
Puhui Desktop Reflow Oven T962A+
- Packing Size: 55*50*35cm
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350
- Gross Weight: 17.5kg
- Max Soldering Area: 450*370mm
Taian Puhui T-962A+, Desktop Reflow Oven T962A+
- Packing Size: 55*50*35cm
- Rated Power: 2300W
- Process Period: 1--8min
- Temperature Range: 0-350
- Gross Weight: 17.5kg
- Max Soldering Area: 450*370mm