4,208 Potting Compound
results from95 suppliers
Low Viscosity Excellent Heat Dissipation Silicone Thermal Conductive Potting Compound for New Energy Battery Pack
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Epoxy Resin Compound Epoxy Resin Potting Compound for Circuit Board
- Molecular Principal Chain: Carbon Chain Polymer
- Color: Color-Tunable
- Appearance: Black Viscous Liquid (Color-Tunable)
- Density: 1.70-1.85
- Viscosity: 1000-3500
- Glass Transition Temperature: 45-75
Electronic Polyurethane Potting Adhesive/Potting Compounds for Electronics/Clear Potting Compound Electronic
- Molecular Principal Chain: Carbon Chain Polymer
- Color: Clear
- Appearance: Black Viscous Liquid (Color-Tunable)
- Classification: Double Components Adhesives
- Usage: Construction, Packing, Decoration
- Automatic Defoaming: Easy to Use
Electrical Epoxy Potting Compound for Sensor
- Molecular Principal Chain: Carbon Chain Polymer
- Color: Black
- Appearance: Black Viscous Liquid
- Density: 1.84-1.90
- Viscosity: 40000-80000
- Glass Transition Temperature: Greater Than O R Equal to 160
Lower Costs Light Weight High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Low Viscosity Insulation Liquid Electronic Potting Compound Silicone Rubber
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Hybrid Insulation
- Material: Silicone
- Thermal Rating: 220 220
- Maximum Voltage: 20KV~100KV
Thermally Conductive Epoxy Electrically Insulating Adhesive 1001 Silicone Liquid Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Electronic Potting Compound Silicone Rubber for Electronic Products
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Hybrid Insulation
- Material: Silicone
- Thermal Rating: 220 220
- Maximum Voltage: 20KV~100KV
High Thermal Conductivity EV Battery Silicone Rubber Potting Compound
- Application: Automobile, Woodworking
- Material: Silicone
- Main Agent Composition: Inorganic Adhesive Material
- Characteristic: Thermal Conductive
- Promoter Composition: Curing Agent
- Composition: Inorganic Material
Waterproof, Conductive Silicone Potting Compound for Electronics
- Application: Insulators
- Type: Liquid
- Chemistry: Hybrid Insulation
- Material: Silicone
- Thermal Rating: 250 250
- Classification: Hybrid Insulation Materials
Vs-Tp2001 2.0 Thermal Conductivity Silicone Thermally Conductive Liquid Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Electronic Potting Compound Addition Silicon for Solar (PV) Panels
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Hybrid Insulation
- Material: Silicone
- Thermal Rating: 220 220
- Maximum Voltage: 20KV~100KV
High Volume Resistivity Yellow Transparent 2-Part Polyurethane Potting Compound for New Energy Charger
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Precision Bonding Chemical Protection Potting Compound No Harm environment
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
9102 Electronic Components Potting Adhesive, High-Temp Silicone Potting Material Compound
- CAS No.: 7085-85-0
- Formula: Mixture
- EINECS: 230-391-5
- Bonding Function: High Temperature Resistant Adhesive
- Morphology: Paste
- Application: Automobile, Electronical Components
Elastic 2-Part PCB Board Casting Potting Resin Compound for Electronics
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
RTV-2 Silicone Rubber Silicon Gel Sealing Compound for LED Screen Potting Liquid Silicone
- Raw Material: Organic Silicone
- Material: Silicone Rubber
- Appearance: Liquid
- Form: Liquid Rubber
- Packing: Drum Packaging
- Standard: 30*30*45.5cm
High Temperature 1001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Two-Component Addition Silicone Potting Compound 1: 1 10: 1 Low Hardening Shrinkage Good Waterproof Moisture Proof for Electronics Modules
- Shelf Life: 18 Months
- Produce Capacity: 1000 Tons/Month
- Lead Time: 5-7 Days
- Free Sample: Available
- Packing: Drum
- Port: Shenzhen
Excellent Thermal Conductivity Prevent Overheating Components and Motors Compound Potting
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Chemical Protection in Complex Assemblies Aero Marine Products Compound Potting
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Heat-Resistant Against Moisture High Thermal Conductivity Epoxy Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
PCB Application Two Component Thermal Conductive Silicone Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
PCB and Capacitor Two Componentsthermally Conductive Silicone Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
UL94 V0 Thermally Conductive Flame Retardant Polyurethane Potting Compound for EV Charger
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Sp297 Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Two-Component Material High Thermal Conductivity Potting Compound
- Material: Organic Silicone
- Application: Industrial
- Certification: ISO, FDA, REACH, RoHS
- Use: Potting
- Appearance: Liquid
- Hardness: 35 Shore a
Excellent Thermal Conductivity and Aging Resistance Vs-Tp2001 Fixation Potting and Encapsulation Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Ab Potting Compound for Sensors Voltage Transformer
- Material: Organic Silicone
- Application: Industrial
- Certification: ISO, FDA, REACH, RoHS
- Use: Potting
- Appearance: Liquid
- Hardness: 25 Shore a
High Temperature Vs-Tp2001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
High Performance PCB Component Thermally Conductive Silicone Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Se685 Sepna Two-Part Epoxy Potting Adhesive Compound for Throttling Valves for Transformers
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Structural Adhesive
- Application: Automobile, Construction
- Material: Epoxy
Industrial-Grade Corrosion Protection Electronics Silicone Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
OEM Yellow Transparent 2-Part PU Potting Compound for Home Appliances PCB Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Encapsulate CPU Epoxy Chemicals 1001 Thermally Conductive Silicone Liquid Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Two-Component Compound for Pouring Electronic Circuits
- Material: Organic Silicone
- Application: Industrial
- Certification: ISO, FDA, REACH, RoHS
- Use: Potting
- Appearance: Liquid
- Hardness: 25 Shore a
Protective Barrier Around High-Heat Electrical Appliances Aging Resistance Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
New Product Against Environmental Influences Potting Compound for Electricity
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Flexible Enhanced Mechanical Strength Vibration Resistance Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Two Component Thermally Conductive Flame Retardant UL 94 V0 Polyurethane Silicone Compound for Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking