1,339 Thermal Potting Compound
results from29 suppliers
High Temperature Vs-Tp1501 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Thoughtful Instruction Printed Circuit Boards Potting Compound Thermally Conductive
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Industrial-Grade Corrosion Protection Electronics Silicone Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Flexible Enhanced Mechanical Strength Vibration Resistance Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Silver Loaded Electrically and Thermally Liquid Conductive 1001 Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
PCB Component Protection and Insulation Silicone Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Encapsulate CPU Epoxy Chemicals 1001 Thermally Conductive Silicone Liquid Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Construction, Packing
Low Viscosity Self-Leveling Electronic Products Vs-Tp0501 Thermally Conductive Potting Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
Sample Free Black High Thermal Ab Epoxy Potting Compound
- Material: Epoxy
- Application: Industrial, Potting Compund
- Main Raw Material: Epoxy
- Type: Two Component
- Color: White, Black, Grey, Transparent
- Hardness: D75
1: 1 Two Component Thermal Conductive Silicone Electronic Potting Compound
- Color: White or Black Paste
- Material: Silicone, Composite Materials
- Shelf Life: 12 Months
- Quality: 100% Silicone
- Certificate: SGS RoHS
- Application: Solar Module; Solar Panels
Transparent Colorless 2-Part Polyurethane Potting Compound for Home Appliances PCB Sealing
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Low Cte High Thermally Conductive Flame Retardant UL 94V-0 Black Two Component Epoxy Potting Compound for Electric Control Unit
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
UL94 V0 High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Excellent Mechanical Properties and Extensibility Solid or Gelatinous Compound
- CAS No.: N/a
- Formula: N/a
- EINECS: N/a
- Bonding Function: Thermal Paste
- Morphology: Curing Glue
- Application: Automobile, Woodworking
UL94 V0 Thermally Conductive Flame Retardant Polyurethane Potting Compound for EV Charger
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
OEM Yellow Transparent 2-Part PU Potting Compound for Home Appliances PCB Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Increased Chemical Protection in Complex Assemblies High Thermal Conductivity Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Sp297 Flame Retardant Grade UL94-V0 High-Performance Two-Component Polyurethane Potting Compound for Filling and Sealing of Charging Pile
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Sealing and Potting
- Application: Automobile, Electronics
- Material: Polyurethane
Two Component Epoxy Potting Compound for Ignition Controller Electronics Transformer Electric Motor
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Two Component Black Flame Retardant Polyurethane Epoxy Silicone Potting Compound for Motor Electronic Capacitor
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Simple Usage Protection of Power Supply Modules Silicone Thermally Conductive Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Excellent Electrical Insulation Two Component Epoxy Potting Compound for Ignition Controller Electronics Transformer Electric Motor
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Anti-Corrosive High Thermally Conductive Flame Retardant UL 94V-0 Black Two Component Epoxy Potting Compound for Electric Control Unit
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
High Quality No Bubbles Yellow Transparent 2-Part Polyurethane Potting Compound for IGBT Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
High Quality Soft Yellow Transparent 2-Part Polyurethane Potting Compound for IGBT Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Against Moisture Prevent Short Circuits Conductive Silicone Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
High Quality Yellow Transparent 2-Part PU Potting Compound for IGBT Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Yellow Transparent 2-Part PU Potting Compound for Home Appliances PCB Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Chemical-Resistant Prevent Short Circuits Potting Compound Polyurethane Composition
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
Safe High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Easy to Operate High Volume Resistivity Thermally Conductive Flame Retardant Polyurethane Potting Compound
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
New Product Against Environmental Influences Potting Compound for Electricity
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
No Shrinkage High Thermally Conductive Flame Retardant UL 94V-0 Black Two Component Epoxy Potting Compound for Electric Control Unit
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Elastic 2-Part PCB Board Casting Potting Resin Compound for Electronics
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Ab Potting Compound for Sensors Voltage Transformer
- Material: Organic Silicone
- Application: Industrial
- Certification: ISO, FDA, REACH, RoHS
- Use: Potting
- Appearance: Liquid
- Hardness: 25 Shore a
PCB Connection and Fixation in Challenging Environmental Conditions Potting Compound
- Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
- Type: Liquid
- Chemistry: Curing Glue
- Material: Silicone
- Thermal Rating: UL94
- Maximum Voltage: No
High Quality Shore a 80 Yellow Transparent 2-Part PU Potting Compound for IGBT Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Sp297 Two Component High Volume Resistivity Thermally Conductive Flame Retardant UL 94 V0 Polyurethane Silicone Compound for Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Transparent Colorless 2-Part PU Potting Compound for Home Appliances PCB Electronics Potting
- CAS No.: 9009-54-5
- Formula: CH3h8n2o
- EINECS: 210-898-8
- Bonding Function: Potting Sealing
- Morphology: Liquid
- Application: Automobile, Construction, Woodworking
Two-Component Compound for Pouring Electronic Circuits
- Material: Organic Silicone
- Application: Industrial
- Certification: ISO, FDA, REACH, RoHS
- Use: Potting
- Appearance: Liquid
- Hardness: 25 Shore a