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Multilayer Fr4 PCB Board Printed Circuit Board Motherboard PCB Assembly HDI Pth PCB Design Layout for Electronics

FOB Price:	US$0.10-100.00 / Piece
Min. Order:	1 Piece

Min. Order	FOB Price
1 Piece	US$0.10-100.00

Port:	Shenzhen, China
Production Capacity:	10000PCS/Years
Payment Terms:	L/C, T/T

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Product Description

Company Info

Basic Info.

Type

Rigid Circuit Board

Dielectric

FR-4

Material

Pi Material,Highspeed Material,Metal Substrate PCB

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Electrolytic Foil+Delay Pressure Foiother

Base Material

Copper

Insulation Materials

Epoxy Resin

Model

FR-4

Solder Mask

Black

PCB Thickness

HASL/Lead Free HASL 0.6-4.0mm

Surface Finish

HASL,OSP,Enig,Immersion Silver,Flash Gold

Hole

0.1/0.15/0.2mm Max Thickness of Mechanical Hole

Width/Space

Inner Layer

Transport Package

Carton

Origin

Shenzhen, China

HS Code

8534009000

Product Description

Place of Origin:Shenzhen, China
Brand Name:FAST PCB Technology
Copper Thickness:0.5-6oz
Board Thickness:0.4-4.2mm
Min. Hole Size:0.1-6.5mm
Min. Line Width:3mil
Min. Line Spacing:3mil
Surface Finishing:
Max Layer:48L
PCB Standard:IPC-A-600
Solder Mask:Green,Black,Blue,Red, White,Yellow, Matt Green,Matt Black, Matt Blue
Legend:White, Black,Red,Yellow

No	Items		Capabilities(Order size/Delivery area <5m2)	Capabilities(Order size/Delivery area ≥5m2)
1	Materia l	HDI PCB material	IT-180A,S1000-2,TU-768(TU-752),TU-862HF,IT-170GRA1, S7439C,R-5775G,IT-968,TU-883,IT-988GSE,R-5785N, Meteorwave4000	IT-180A,S1000-2,TU-768(TU-752),R-5775G,R-5785N
2		High CTI	S1151G(Halogen free))	S1151G(Halogen free))
3		PI material	VT-901,VT-90H,85N	VT-901,VT-90H,85N
4		HighSpeed material	TU-862 HF(Halogen free)),IT-170GRA1(Halogen free),FR408HR ,TU-872 SLK,R-5725S,TU-872 SLK SP,N4103-13,N4103-13 EP, N4103-13 SI,N4103-13 EPSI,N4800-20 SI,S7439C,R-5775G,IT- 968,R-5775N,IT-968 SE,TU-883,R-5775K,R-5785N, Meteorwave4000,IT-988G SE,TU-933+	TU-862 HF(Halogen free)),IT-170GRA1(Halogen free)),TU-872 SLK, R-5725S,TU-872 SLK SP,N4103-13,N4103-13 EP,N4103-13 SI,N4103-13 EPSI,R-5775G,IT-968,R-5775N,IT-968 SE,TU-883,R-5785N, Meteorwave4000,IT-988G SE,TU-933+
5		High Frequency CCL material	Aerowave 300,ZYC8300,ZYF3000CA-P,RO4730G3,RO4533,RO4533 Lopro,LNB33,S7136H,HC35,RO4350B,RO4350B Lopro,TLF-35,RF- 35,RF-35TC,RF-45,RF-60TC,TLY-5,RT5880,ZYF220D,DiClad 880 ,TLX-8,F4BM-2,RO4725JXR,RO4725JXR lopro,TLX-9,GF255, ZYF265D,TSM-DS3M,RT6002,TSM-DS3,RO4003C,RO4003C Lopro, mmWave77,RO3003,RT6010LM,AD1000,AD1000L,TP-2,TMM10	Aerowave 300,RO4730G3,RO4533,RO4533 Lopro,S7136H,RO4350B, RO4350B Lopro,RF-35,RF-35TC,RF-45,RF-60TC,TLY-5,RT5880,DiClad 880,TLX-8,RO4725JXR,RO4725JXR lopro,TSM-DS3M,RT6002,RO4003C, RO4003C Lopro,RO3003,RT6010LM
6		High Frequency PP material	(FR-28-0040-50,FR-25-0021-45,FR-26-0025-60,FR-27-0045-35, FR-27-0050-40),Aerobond350,Synamic 6B,RO4450F	Synamic 6B,RO4450F
7		Metal substrate PCB	T110,T111,T1112,T112B,T112C,VT-4A1,VT-4A2,VT-4B3,VT-4B5 ,92MCL,1KA04,1KA06,1KA08,VT-4A2,T512,	T110,T111,T1112,T112B,T112C,VT-4A1,VT-4A2,VT-4B3,VT-4B5, 92MCL,1KA04,1KA06,1KA08VT-4A2,T512,
8		Metal substrate PCB PP	ST115B,VT-4A2,1KA04,1KA06,1KA08	ST115B,VT-4A2,1KA04,1KA06,1KA0
9		Hybrid laminating	Rogers,Taconic,Arlon,Nelco&fr4,high speed material & FR4, High Frequency material & high speed material	Rogers,Taconic,Arlon,Nelco FR-4,high speed material & FR4,High Frequency material & high speed material
10	PCB type	Rigid PCB	Backplane,HDI,High multi-layer blind&buried PCB,Embedded Capacitance,Embedded resistance board , Heavy copper power PCB,Backdrill,Semiconductor Test products.	Backplane,HDI,High multi-layer blind&buried PCB,Backdrill&Heavy copper power PCB
11	Buildin gs	Blind&buried via type	mechanical blind&burried vias with less than 3 times laminating	mechanical blind&burried vias with less than 2 times laminating
12	Buildin gs	HDI	1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating	1+n+1,1+1+n+1+1,2+n+2((n buried vias≤0.3mm),Laser blind via can be filling plating
No	Items		Capabilities(Order size/Delivery area <5m2)	Capabilities(Order size/Delivery area ≥5m2)
13	Surface Finish treatme nt	Surface Finish treatment(lead free)	Flash gold(electroplated gold),ENIG,Hard gold,Flash gold, HASL Lead free,OSP,ENEPIG,Soft gold, Immersion silver,Immersion Tin,ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge	Flash gold(electroplated gold),ENIG,Hard gold,Flash gold,HASL Lead free,OSP,ENEPIG,Soft gold, Immersion silver,Immersion Tin,ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge
14		Surface Finish treatment(leaded)	HASL	HASL
15		Aspect ratio	10:1(HASL/Lead free HASL,ENIG,Immersion silver,Immersion Tin,ENEPIG);8:1(OSP)	10:1(HASL/Lead free HASL,ENIG,Immersion silver,Immersion Tin, ENEPIG);8:1(OSP)
16		Max finished size	HASL/Lead free HASL 22"24";gold finger 24"24";hard gold 24"32";ENIG 21"27";FLASH GOLD21"48";Immersion tin 16"21";immersion silver:width max 24",length no limited; OSP 610*720mm;	HASL/Lead free HASL22"24";gold finger 24"24";hard gold 24"32"; ENIG 21"27";FLASH GOLD21"48";Immersion tin 16"21";immersion silver:width max 24",length no limited;OSP 610*720mm;
17		MIN finished size	HASL 5"6";Lead free HASL 6"10";gold finger 12"16";hard gold 3"3";FLASH GOLD 8"10";Immersion tin/silver 2"4"; OSP2"*2";	HASL 5"6";Lead free HASL 6"10";gold finger 12"16";hard gold 3"3";FLASH GOLD 8"10";Immersion tin/silver 2"4";OSP2"*2";
18		PCB thickness	HASL/Lead free HASL 0.6-4.0mm;gold finger 1.0-3.2mm;hard gold 0.1-8.0mm;ENIG 0.2-7.0mm;FLASH GOLD 0.15-5.0mm; Immersion tin 0.4-5.0mm;immersion silver 0.2-4.0mm;OSP 0.2- 6.0mm;	HASL/Lead free HASL 0.6-4.0mm;gold finger 1.0-3.2mm;hard gold 0.1- 5.0mm;ENIG 0.2-7.0mm;FLASH GOLD 0.15-5.0mm;Immersion tin 0.4- 5.0mm;immersion silver 0.2-4.0mm;OSP 0.2-6.0mm;
19		MAX high to gold finger	1.5inch	1.5inch
20		Min space between gold fingers	5mil	5mil
21		Min block space to gold fingers	5mil	5mil
22	Plating /coatin g thickne ss	HASL	2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)	2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)
23		OSP	osp thickness:0.2-0.6μm	osp thickness:0.2-0.6μm
24		ENIG	gold thickness :0.05-0.10μm,Nickelthickness :3-8μm	gold thickness :0.05-0.10μm,Nickelthickness :3-8μm
25		Immersion silver	silver thickness :0.15-0.4μm	silver thickness :0.15-0.4μm
26		Immersion tin	tin thickness :≥1.0	tin thickness :≥1.0
27		Hard gold	gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process)	gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process)
28		Soft gold	gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process)	gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process)
29		ENEPIG	gold thickness :0.05-0.10μm,Nickelthickness :3-8μm; pd thickness:0.05-0.15μm(welding) pd thickness:0.075-0.20μm(Gold wire bond) pd thickness:≥0.3μm(special function)	gold thickness :0.05-0.10μm,Nickelthickness :3-8μm; pd thickness:0.05-0.15μm(welding) pd thickness:0.075-0.20μm(Gold wire bond) pd thickness:≥0.3μm(special function)
30		Flash Gold	gold thickness :0.025-0.10μm,Nickelthickness :≥3μm,bass copper max thickness 1OZ	gold thickness :0.025-0.10μm,Nickelthickness :≥3μm,bass copper max thickness 1OZ
No			Capabilities(Order size/Delivery area <5m2)	Capabilities(Order size/Delivery area ≥5m2)
31		Gold finger	gold thickness :0.25-1.5μm,Nickelthickness :≥3μm	gold thickness :0.25-1.5μm,Nickelthickness :≥3μm
32		Carbon	10-50μm	10-50μm
33		Soldermask	on copper area(10-18μm),on via pad(5-8μm),on circuits around the corner, ≥5μm ,just for one-time print & copper thickness need lower than 48um	on copper area(10-18μm),on via pad(5-8μm),on circuits around the corner, ≥5μm ,just for one-time print & copper thickness need lower than 48um
34		Blue plastic	0.20-0.80mm	0.2-0.4mm
35	Hole	0.1/0.15/0.2mm MAX thickness of mechanical hole	0.8mm/1.6mm/2.5mm	0.6mm/1.2mm/1.6mm
36		Min laser drilling size	0.1mm	0.1mm
37		Max laser drilling size	0.15mm	0.15mm
38		Finshed mechanical hole size	0.10-6.2mm(corresponding drilling tool size0.15-6.3mm)	0.15-6.2mm(corresponding drilling tool size0.2-6.3mm)
39			A,Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil)	A,Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil)
40			B,Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil)	B,Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil)
41			C,Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil	C,Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil
42			D,Min connecting hole size is 14mil(corresponding drilling tool size is 18mil)	D,Min connecting hole size is 14mil(corresponding drilling tool size is 18mil)
43			E,Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil)	E,Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil)
44		MAX aspect ratio for Hole plate	20:1(hole diameter>8mil)	15:1
45		Max aspect ratio for laser via filling plating	1:1	0.9:1
46		Max aspect ratio for mechanical depth-control drilling board(Blind hole drilling depth/blind hole size)	1.3:1(hole diameter≤0.20mm),1.15:1(hole diameter≥0.25mm)	0.8:1,hole diameter≥0.25mm
47		Min. depth of Mechanical depthcontrol(backdrill)	0.2mm	0.2mm
48		Min gap between hole wall and conductor (None blind and buried via PCB)	PIN-LAM:3.5mil(≤4L),4mil(5-8L),4.5mil(9-12L);5mil (13-16L),6mil(≥17L)	7mil(≤8L),9mil(10-14),10mil(>14L)
49		Min gap between hole wall conductor (Blind and buried via PCB)	7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)	8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)
No			Capabilities(Order size/Delivery area <5m2)	Capabilities(Order size/Delivery area ≥5m2)
50		Min gab between hole wall conductor (Laser blind hole buried via PCB)	7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)	7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)
51		Min space between laser holes and conductor	5mil	6mil
52		Min space bwteen hole walls in different net	10mil	10mil
53		Min space bwteen hole walls in the same net	6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)	6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)
54		Min space bwteen NPTH hole walls	8mil	8mil
55		Hole location tolerance	±2mil	±2mil
56		NPTH tolerance	±2mil	±2mil
57		Pressfit holes tolerance	±2mil	±2mil
58		Countersink depth tolerance	±0.15mm	±0.15mm
59		Countersink hole size tolerance	±0.15mm	±0.15mm
60	Pad(rin g)	Min Pad size for laser drillings	10mil(for 4mil laser via),11mil(for 5mil laser via	10mil(for 4mil laser via),11mil(for 5mil laser via
61		Min Pad size for mechanical drillings	16mil(8mildiameter)	16mil(8mildiameter)
62		Min BGA pad size	HASL:10mil,,Lead free min BGA (solder mask 16mil,etching 10mil), other surface technics are 7mi	HASL:10mil,Lead free min BGA (solder mask 16mil,etching 10mil), flash gold 7 mil,other surface technics are 10mil
63		Pad size tolerance(BGA)	+/-1.2mil(pad <12mil);+/-10%(pad≥12mil)	+/-1.5mil(pad<10mil);+/-15%(pad≥10mil)
64		Inner layer	1/2OZ:3/3mil	1/2OZ: 3/3mil
65			1OZ: 3/4mil	1OZ: 3/4mil
66			2OZ: 4/5mil	2OZ: 4/5.5mil
67			3OZ: 5/8mil	3OZ: 5/8mil
68			4OZ: 6/11mil	4OZ: 6/11mil
69			5OZ: 7/13.5mil	5OZ: 7/14mil
70			6OZ: 8/15mil	6OZ: 8/16mil
71			7OZ: 9/18mil	7OZ: 9/19mil
72			8OZ: 10/21mil	8OZ: 10/22mil
73			9OZ: 11/24mil	9OZ: 11/25mil
74			10OZ: 12/27mil	10OZ: 12/28mil
No	Width/S pace		Capabilities(Order size/Delivery area <5m2)	Capabilities(Order size/Delivery area ≥5m2)
75		Outer layer	1/3OZbase copper:3/3mil	1/3OZbase copper:3.5/4mil
76			1/2OZbase copper:3.5/3.5mil	1/2OZbase copper:3.9/4.5mil
77			1OZbase copper: 4.5/5mil	1OZbase copper: 4.8/5.5mil
78			1.43OZbase copper(positive):4.5/6	1.43OZbase copper(positive):4.5/7
79			1.43OZbase copper(negative):5/7	1.43OZbase copper(negative):5/8
80			2OZbase copper: 6/7mil	2OZbase copper: 6/8mil
81			3OZbase copper: 6/10mil	3OZbase copper: 6/12mil
82			4OZbase copper: 7.5/13mil	4OZbase copper: 7.5/15mil
83			5OZbase copper: 9/16mil	5OZbase copper: 9/18mil
84			6OZbase copper: 10/19mil	6OZbase copper: 10/21mil
85			7OZbase copper: 11/22mil	7OZbase copper: 11/25mil
86			8OZbase copper: 12/26mil	8OZbase copper: 12/29mil
87			9OZbase copper: 13/30mil	9OZbase copper: 13/33mil
88			10OZbase copper: 14/35mil	10OZbase copper: 14/38mil
89		Width tolerance	≤10mil:+/-1.0mil	≤10mil:+/-20%
90		Width tolerance	>10mil:+/-1.5mil	>10mil:+/-20%
91	Solderm ask	MAX drilling tool size for via filled with Soldermask (double side)	0.9mm	0.9mm
92		Soldermask color	Green matte/glossy, Black matte/glossy, Blue matte/glossy, Red, White,Yellow,	Green matte/glossy, Black matte/glossy, Blue matte/glossy, Red, White,Yellow,
93		Silkscreen color	White, Yellow, Black	White, Yellow, Black
94		MAX hole size for via filled with Blue glue aluminium	5mm	4.5mm
95		Finish hole size for via filled with resin	0.1-1.0mm	0.1-1.0mm
96		Max aspect ratio for via filled with resin board	12:1	8:1
97		Min width of soldermask dam	base copper≤0.5OZ:4mil(best3.5mil,solder mask can't be white/black),5.5mil(best is 5mil,black/white),8.0mil(on copper area)	base copper≤0.5OZ:4mil(best3.5mil,solder mask can't be white/black),5.5mil(best is 5mil,black/green),8.0mil(on copper area)
98			base copper1OZ:4mil(green),5mil(solder mask can't be white/black),5.5mil(black/white),8.0mil(on copper area)	base copper1OZ:4mil(green),5mil(solder mask can't be white/black),5.5mil(black/white),8.0mil(on copper area)
99			base copper1.43OZ:4mil(green),5.5(can't be black/white), 6mil(black/white),8.0mil(on copper area)	base copper1.43OZ:4mil(green),5.5(solder mask can't be white/black),6mil(black/white),8.0mil(on copper area)
100			base copper2-4OZ:6mil,8mil(on copper area)	base copper2-4OZ:6mil,8mil(on copper area)
No			Capabilities(Order size/Delivery area <5m2)	Capabilities(Order size/Delivery area ≥5m2)
101	Routing	Min space of the V-CUT does not reveal the copper ( Central Line of v-cut to internal/external circuits,H means board thickness)	H≤1.0mm:0.3mm(20°V-CUT),0.33mm(30°),0.37mm(45°);	H≤1.0mm:0.3mm(20°V-CUT),0.33mm(30°),0.37mm(45°);
102			1.0<H≤1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°);	1.0<H≤1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°);
103			1.6<H≤2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°);	1.6<H≤2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°);
104			2.4	2.4
105		V-CUT symmetrical tolerance	±4mil	±4mil
106		MAX V-CUT lines	100	100
107		V-CUT angle tolerance	±5°	±5°
108		V-CUT angle	20,30,45°	20,30,45°
109		Gold finger bevelling	20,30,45°	20,30,45°
110		Gold finger bevelling tolerance	±5°	±5°
111		Min space of gold finger chamfering noninterference tab	2.5mm	7mm
112		Min gap between the side of gold finger and the shape edge line	8mil	10mil
113		Depth tolerance of depth-control groove milling	±0.10mm	±0.10mm
114		Routing tolerance (edge to edge)	±4mil	±4mil
115		Min tolerance for routing slot (PTH)	width/length tolerance ±0.13mm	width/length tolerance ±0.13mm
116		Min tolerance for routing slot (NPTH)	width/length tolerance ±0.10mm	width/length tolerance ±0.10mm
117		Min tolerance for drilling slot (PTH)	slotwidth±0.075mm;slotLength/slotwidth<2:slotLength+/- 0.1mm;slotLength/slotwidth≥2:slotLength+/-0.075mm	slotwidth±0.075mm;slotLength/slotwidth<2:slotLength+/-0.1mm; slotLength/slotwidth≥2:slotLength+/-0.075mm
118		Min tolerance for drilling slot (NPTH)	slotwidth±0.05mm;slotLength/slotwidth<2:slotLength+/- 0.075mm;slotLength/slotwidth≥2:slotLength+/-0.05mm	slotwidth±0.05mm;slotLength/slotwidth<2:slotLength+/-0.075mm; slotLength/slotwidth≥2:slotLength+/-0.05mm
No			Capabilities(Order size/Delivery area <5m2)	Capabilities(Order size/Delivery area ≥5m2)
119	Local mixed pressur e	Min gap between mechanical hole wall and conductor (Local mixed pressure area)	≤10L:14mil;12L:15mil;>12L:18mil	≤10L:14mil;12L:15mil;>12L:18mil
120	Local mixed pressur e	Min gap between mechanical hole wall and the junction of local mixed pressure	≤12L:12mil;>12L:15mil	≤12L:12mil;>12L:15mil
No			Capabilities(Delivery area <5m2)	Capabilities(Delivery area ≥5m2)
137	Others	Max finished copper thickness to internal&external layer	inner Layer:10 OZ;outer layer:11 OZ	inner Layer:4 OZ;outer layer:5 OZ
138		finished copper thickness to external layer	12,18μmbase copper:≥35.8(reference value:35.8-42.5);≥ 40.4(reference value:40.4-48.5)	12,18μmbase copper:≥35.8(reference value:35.8-42.5);≥40.4 (reference value:40.4-48.5)
139			35,50,70μmbase copper:≥55.9;≥70;≥86.7	35,50,70μmbase copper:≥55.9;≥70;≥86.7
140			105,140μmbase copper:≥117.6;≥148.5	105,140μmbase copper:≥117.6;≥148.5
141		Layer count	1-40L	1-20L
142		PCB thickness	0.20-7.0mm(no solder mask);0.40-7.0mm(with solder mask);	0.3-5.0(no solder mask),0.4-5.0(with solder mask);
143		PCB thickness tolerance(Normal )	thickness±10%(>1.0mm);±0.1mm(≤1.0mm);	thickness±10%(>1.0mm);±0.1mm(≤1.0mm);
144		PCB thickness tolerance(Special )	thickness±0.1mm(≤2.0mm);±0.15mm(2.1-3.0mm)	thickness±10%(≤2.0mm);±0.15mm(2.1-3.0mm)
145		Min finished PCB size	10*10mm	50*100mm
146		Max finished PCB size	24.5*47inch	24*47inch
147		ionic soil	≤1ug/cm2	≤1ug/cm2
48		Min bow&twist	0.3%(This ability request same laminated plate type, symmetry laminated construction, the difference of symmetry layer Copper area within 10%, uniformity wiring , excluding the large area of copper and base material ,haven't plate and single panel, and the long side size≤ 21 inch)	0.75%
149		Impedance tolerance	±3Ω(<30Ω),±5%(≥60Ω),±7%(≥45Ω)	±3Ω(<30Ω),±10%(≥30Ω);
150		Laser blind via size with filling plating	4-5mil(priority4mil)	4-5mil(priority 4mil)
151		Max aspect ratio for laser via filling plating	1:1(Depth included copper thickness)	1:1(Depth included copper thickness)

Address: Third Floor, Building I, 2nd Industrial Park, Shenzhen, Guangdong, China

Business Type: Manufacturer/Factory

Business Range: Computer Products, Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Manufacturing & Processing Machinery, Tools & Hardware

Management System Certification: ISO 9001, ISO 14001

Main Products: PCB, PCBA

Company Introduction: Shenzhen Fast PCB Technology Co., Ltd. Was established in 2008. It is a high-tech enterprise in Shenzhen. Known as an experienced professional PCB manufacturer, it can produce all kinds of PCB(Flexible board, Rigid board, Rigid-flex board, HDI PCB, Optical module PCB and so on), it Also can provide PCBA one-stop service like PCB design, SMT and electronic components.

The company is located in Caowei Second Industrial Park, Shenzhen, has factory workshop of 20000 square meters, original fixed assets of 1600 million US dollar and more than 40 sets of Imported equipment. With more than 420 employees, it has established sales department, Engineering department, quality department, production department, manufacturing planning

Department, purchasing department, equipment department, human resources department, and administration department, Totally nine departments and ten production teams. The annual Output of finished printed circuit boards is 250, 000 square meters. It has passed high-tech Enterprise certification, ISO9001-2000 quality management system international certification, UL certification, ISO14001 environmental management system certification, and strictly Implementing the IATF 16949, ISO13485, GJB9001-2017 quality system standard. The product Quality is in line with the national (GB4588.2, GB4588.4) and IPC-A-600G standards.

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