Qingdao Wocheng Microelectronics Co., Ltd.

Qingdao Wocheng Microelectronics Co., Ltd. Was established in Qingdao, China, to provide advanced film mixing and integration technology. Specializing in the production of various types of thin film circuits, film heat sinks for optoelectronic devices, photovoltaic modules, aerospace, aerospace, radar, electronic countermeasures, airborne, network modules, transmission lines, amplification modules, power dividers, phase shifters, attenuators. Provide multi-chip module (MCM) assembly technology and related metal package shell, resistor network, filter, integrated resistor, metal film heat sink, carrier, transition block, gasket, ceramic micro-hole metallization, graphics, etc. Ceramic products made of metal film and thick film process. Common metal film: Ti, Ti-W, Ni, Cu, PT, Au, generally multi-layer metal structure, total thickness ≥ 1.5μ M Common resistance film: TaN, common standard square resistance: 50Ω -100Ω , processing limit: The finest The strip width is 0.03mm, the metal strip has a minimum pitch of 0.05mm, and the precision is ± 0.005mm; The minimum apparent size of the substrate is 0.1× 0.2mm, the accuracy is ± 0.02mm; The minimum resistance is 5Ω , the maximum resistance is 500KΩ , and the highest precision is ± 0.5%. The company′s product quality control standard (IS09002 international quality standard system), Wo Wei′s manufacturing equipment and clean room is designed and built for film hybrid integration technology, multi-chip module (MCM) assembly, widely used in aerospace, aviation, weapons, Ships, communications, electronics and other fields.

Werner offers solutions for metallization, patterning, and packaging for a variety of materials, from polished alumina to substrates of aluminum nitride, quartz, sapphire, and other high-frequency materials. Standard metallization of Ti/Au, TaN/Ti/Au to TaN/Ti/Ni/Au. Circuit characteristics include fine pitch conductors, integrated resistors, vias, surrounds, double-sided patterns, and dielectric bridges.

At WoW, we continue to develop our device development and material processing capabilities to reflect the changing needs of our customers. If you have circuit and package requirements that are beyond the "normal" film and package type, please contact us. Warren will be happy to discuss your application needs with you and is committed to developing solutions.