Basic Info.
Application
Laptop, Desktop, Server, Ultrabook,Tablet.Two-in-One PC
Interface Type
SATA III,Sataii,Pcie 3.0
Reliability
Write Endurance: 8 Years @ 100g Write/Day(32g)
Environment
Operation Temperature: -0~70°c
Transport Package
Bulk Packaging or as Per Customer Request
Specification
42*22*3.2mm, 60*22*3.2, 80*22*3.2, 110*22*3.2
Product Description
Biwin Ultrafast SATA 3.0 Interface 2240, 2260.2280 MLC nand Flash M. 2 SSD240GB Hard Disk Drive
Basic spec | Form Factor | M.2 (NGFF) |
Interface | | SATAIII |
Dimension | 80*22.*3.2mm 110*22*2.2mm |
Weight | ≤ 6.7g |
Capacity | 16GB-1TB |
Cache (SDram) | 256MB/512MB |
Flash type | MLC /TLCNAND Flash |
Read/Write Performance | Sequential Read | Up to 561MB/s |
Sequential Write | Up to 438MB/s |
4KB Random Read IOPS | 77000 |
4KB Random Write IOPS | 65000 |
Response Time | 0.05ms |
Power Consumption | Power Supply | 5V+5% |
Idle /read/write | 0.27/1.11/1.38 W |
Maximum Ripple | 70 mV(peak to peak) |
4KB Random Write | 2W |
Reliability | Write endurance: 8 years @ 100G write/day(32G) |
Read endurance: unlimited |
MTBF: 2,000,000 hours |
Data retention: >10years @ 25°C |
Data destroy do not support |
Sudden power-off recovery support |
S.M.A.R.T,Trim,NCQ and dynamic power management support |
Static and dynamic wear-leveling |
Auto dynamic Bad block management algorithm |
ECC: Supports BCH ECC 66 bits in 1024 bytes |
Environment | Storage temperature: -40~85 °C |
Operation temperature: -0~70°C |
Humidity: 5%~95% |
Vibration | 2-500Hz at 3.1G |
Shock | 50(G),11(ms), half-sine wave |
Certificates | CE,RoHS,FCC | | |
Warranty | 3 years |
Our factory has full range of product line:
- PCI-E, 2.5"SATA, 2.5"PATA, 1.8"SATA, 1.8"PATA, Half Slim, NGFF, mSATA, mSATA Mini, SATA DOM, PATA DOM, USB DOM
- Memory Card: CFast Card, CF Card;
- Embedded Chips: eMMC, eMCP;
Applicable to harsh operating temperature environments of industrial grade.
Our certifications
Biwin has passed ISO 9001 ISO 14001 and been audited by SGS. All of our SSD
products are RoHS directive-compliant and carry CE, FCC, RoHS approvals.
Our services
Reliability Testing:
- High and Low Temperature Storage
- High and Low Temperature Operation
- High and Low Temperature Cycling
- ESD Testing
- Vibration and Shock Testing
- Room Temperature Aging Testing
- Power Failure Testing
State-of-the-art Manufacturing:
- Quality Guaranteed Products
- Strict Quality Control Standards
- Short Lead Time
- Low Product Defect Rate
- Large production Capacity
Wafer Packaging Service:
- First 12" Wafer Packaging Factory in South China
- Include IC Design, Packaging, Testing, Assembling
- Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP.
Address:
Block4, Tongfuyuindustrialpark, Tanglang, Xili, Nanshan, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Computer Products, Consumer Electronics
Management System Certification:
ISO 9001, ISO 14001, BSCI
Company Introduction:
Founded in 1995 in Shenzhen, China, BIWIN has been devoted to research and application of NAND FLASH. Our products include full-range solid state drives, embedded chips and IC packaging & testing service. With investment in production equipment up to 80 million dollars, we established a 12′′ wafer packaging factory in 2009, which is the first one in South China. With 20 years′ industry expertise and a strong team, BIWIN develops cutting-edge flash storage products, like 2.5 inch, 1.8 inch, mSATA, M. 2, DOM, PCIe SSD, memory cards, eMMC, eMCP, etc, with wide application in consumer, enterprise and industrial field.