SMT/DIP/BGA Multilayer Printed Circuit Board (PCB) Manufacturing & Printed Circuit Board Assembly (PCBA)
| Min. Order: | 10 Pieces |
|---|---|
| Port: | Shenzhen, China |
| Production Capacity: | 100000 Pieces/Year |
| Payment Terms: | L/C, T/T, D/P, Western Union, Paypal, Money Gram |
Product Description
Company Info
Address:
Wanxia Industrial Park, Shajing, Baoan District, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Electrical & Electronics
Management System Certification:
ISO 9001
Main Products:
Electronic Parts Supply, PCB Manufacturing, PCB Assembly
Company Introduction:
[About SNT]
SNT focus on high-quality and economically viable systems combined with unmatched consistency has made us of your best choice.
With customer-centricity, SNT provides turnkey stop for infinite solutions, from customized designs to PCB layouts, from power stencils to soldering solutions, from fabrication to assembly, from heatsinks & mounting kits to thyristors & triacs, from varistors to switches, from capacitors to rectifiers, to thousands of small and large components that are required to build your state-of-the-art PCB.
Our team of creative, experienced and highly competent staffs at SNTPCB take care of customers across the globe, delivering quality every single time.
[SNT Core Values]
Sincerity, Flexibility, Implementation, Innovation
[SNT Electronics Manufacturing Services]
PCB Manufacturing, PCB Assembly, Engineering Assistance, Test Services, Surface Mount Tech (SMT), Logistics Services, Electronic Parts Supply
[SNT Capability]
Layers: 1-28 Layers
Thicker Copper: 1-6 oz
Products Type: HF (High-Frequency) & (Radio Frequency) board,
Imedance controlled board, HDI board, BGA & Fine Pitch board
Solder Mask: Nanya & Taiyo, LPI & Matt red, green, yellow, white, blue, black.
Base Material FR4 (Shengyi China, ITEQ, KB A+, Hz), HI-TG, Fr06, Rogers, Taconic, Argon, Naclo, Isola and so on
Finished Surface: Conventional HASL, Lead-Free HASL, Flash Gold, ENIG (Immersion Gold), OSP (Entek), Immersion Tin, Immersion Sliver, Hard Gold
Selective Surface Treatment: EING(Immersion Gold)+OSP, ENIG(Immersion Gold)+Gold Finger, Flash Gold Finger, Immersion Sliver+Gold Finger, Immersion Tin+Gold Finger
[Technical Specification]
Minimum Line Width/Gap: 3.5/4 mil (Laser Dirll)
Minimum Hole Size: 0.15mm (Mechanical Dirll) 4mil(Laser Dirll)
Minimum Annular Ring: 4 mil
Max Copper Thickness: 6 oz
Max Production Size: 600 mm X 800 mm
Board Thickness: D/S: 0.2-7.0 mm
Multilayer: 0.40-7.0 mm
Min Solder Mask Bridge: ≥ 0.08 mm
Aspect Ratio: 15: 1
Plugging Vias Capability: 0.2-0.8 mm
[Tolerance]
Plated Holes Tolerance: ± 0.08 mm(Min± 0.05)
Non-Plated Hole Tolerance: ± 0.05 mm (Min+0/-0.05 mm or +0.05/-0 mm)
Outline Tolerance: ± 0.15 mm(Min± 0.10 mm)
Insulating Resistance: 50 ohms (Normality)
Peel Off Strength: 1.4 N/mm
Thermal Stress Test: 265 Celsius, 20 seconds
Solder Mask Hardness: 6 H
E-test Voltage: 500 V+15/-0V 30s
Warp and Twist: 0.7% (Semiconductor Test Board 0.3%)
SNT focus on high-quality and economically viable systems combined with unmatched consistency has made us of your best choice.
With customer-centricity, SNT provides turnkey stop for infinite solutions, from customized designs to PCB layouts, from power stencils to soldering solutions, from fabrication to assembly, from heatsinks & mounting kits to thyristors & triacs, from varistors to switches, from capacitors to rectifiers, to thousands of small and large components that are required to build your state-of-the-art PCB.
Our team of creative, experienced and highly competent staffs at SNTPCB take care of customers across the globe, delivering quality every single time.
[SNT Core Values]
Sincerity, Flexibility, Implementation, Innovation
[SNT Electronics Manufacturing Services]
PCB Manufacturing, PCB Assembly, Engineering Assistance, Test Services, Surface Mount Tech (SMT), Logistics Services, Electronic Parts Supply
[SNT Capability]
Layers: 1-28 Layers
Thicker Copper: 1-6 oz
Products Type: HF (High-Frequency) & (Radio Frequency) board,
Imedance controlled board, HDI board, BGA & Fine Pitch board
Solder Mask: Nanya & Taiyo, LPI & Matt red, green, yellow, white, blue, black.
Base Material FR4 (Shengyi China, ITEQ, KB A+, Hz), HI-TG, Fr06, Rogers, Taconic, Argon, Naclo, Isola and so on
Finished Surface: Conventional HASL, Lead-Free HASL, Flash Gold, ENIG (Immersion Gold), OSP (Entek), Immersion Tin, Immersion Sliver, Hard Gold
Selective Surface Treatment: EING(Immersion Gold)+OSP, ENIG(Immersion Gold)+Gold Finger, Flash Gold Finger, Immersion Sliver+Gold Finger, Immersion Tin+Gold Finger
[Technical Specification]
Minimum Line Width/Gap: 3.5/4 mil (Laser Dirll)
Minimum Hole Size: 0.15mm (Mechanical Dirll) 4mil(Laser Dirll)
Minimum Annular Ring: 4 mil
Max Copper Thickness: 6 oz
Max Production Size: 600 mm X 800 mm
Board Thickness: D/S: 0.2-7.0 mm
Multilayer: 0.40-7.0 mm
Min Solder Mask Bridge: ≥ 0.08 mm
Aspect Ratio: 15: 1
Plugging Vias Capability: 0.2-0.8 mm
[Tolerance]
Plated Holes Tolerance: ± 0.08 mm(Min± 0.05)
Non-Plated Hole Tolerance: ± 0.05 mm (Min+0/-0.05 mm or +0.05/-0 mm)
Outline Tolerance: ± 0.15 mm(Min± 0.10 mm)
Insulating Resistance: 50 ohms (Normality)
Peel Off Strength: 1.4 N/mm
Thermal Stress Test: 265 Celsius, 20 seconds
Solder Mask Hardness: 6 H
E-test Voltage: 500 V+15/-0V 30s
Warp and Twist: 0.7% (Semiconductor Test Board 0.3%)
