| Specification |
Type: Ceramics;
Dielectric: Ceramics;
Material: Ceramics;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Ceramics;
Insulation Materials: Ceramics;
Brand: Hspcb;
Customized: Yes;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: 94V-0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PCB Printed Circuit Board;
MOQ: 1 PCS;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Layer: 1-24 Layer;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz-6oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: CE, LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
PCBA Service: Printed Circuit Board PCB PCBA SMT DIP;
Other Service: PCBA/PCB Layout and Design;
Product Name: Multilayer Fr-4 Electronics 94V0 RoHS PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer, LED, Medical, Industrial, Control Board;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: OEM PCB Board;
MOQ: 1 PCS;
Layer: 1-12 Layers;
Min Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Copper Thickness: 0.5 Oz-3oz (18 Um-385 Um);
Board Thickness: 0.2mm-4mm;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
PCB Service: PCB Board/PCBA/PCB Design and Layout;
Test Service: X-ray, Aoi Test, Function Test(100% Test);
Other Service: PCB/PCBA Layout and Design;
Package: ESD Bag, Foam, Carton Box;
Product Name: ISO9001 Electronics PCBA Assembly 94V0 RoHS PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4/High Tg Fr4/Aluminum/Rogers;
Application: All Kinds of Industries;
Flame Retardant Properties: Vo/1/2/UL94/Fr-4;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Unice/OEM;
Layer: 1-20;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Red/Blue/White/Black/Yellow/ etc;
Surface Finish: HASL/HASL Lead Free/OSP/Immersion Gold/Tin/ Silv;
Min Hole Size: 0.2mm;
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
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