What is Coverlay Polyimide Plus adhesive Steel/Pi Stiffener HDI Rigid-Flex PCB Board Manufacturer

Name: Coverlay Polyimide Plus adhesive Steel/Pi Stiffener HDI Rigid-Flex PCB Board Manufacturer
Uploaded: 2023-06-19T11:34:02+08:00
Description: WHY USE HSPCB FOR YOUR PCB MANUFACTURING SERVICES? It can be a challenge to find the optimal supplier for PCBs - meeting each and all customer's expectations and requirements on price, quality, lead

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 pcs US$1.20-7.80 / pcs

Sepcifications

Type Rigid-Flex Board
Dielectric Fr4+Pi
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Medical Instruments
Flame Retardant Properties V0
Mechanical Rigid Rigid Fexible
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Hspcb
Transport Package Vacuum Packing
Specification Customized
Trademark Customized
Origin China
Customized Yes

Product Description

WHY USE HSPCB FOR YOUR PCB MANUFACTURING SERVICES? It can be a challenge to find the optimal supplier for PCBs - meeting each and all customer's expectations and requirements on price, quality, lead times, value-added services, and delivery. You will find options below on our different ...

Learn More

Shenzhen Hesheng Circuit Technology Limited

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB Research and Development, PCB Manufacturing and Sales, PCB Domestic Sales and Export Trade, PCB Assembly and Surrounding Components Sales, PCB Dfm Review & Analysis, PCB Lifecycle Management, PCB Surrounding Components Sales
Registered Capital 50000000 RMB
Plant Area 9800 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	Quick View Coverlay Polyimide Plus adhesive Steel/Pi Stiffener HDI Rigid-Flex PCB Board Manufacturer Contact Now	Quick View Fast Delivery Double Side Fr4 PCB Circuit Board Assembly Contact Now	Quick View Electronic OEM Customized Copper PCBA Manufacturer Contact Now	Quick View OEM Professional Electronic Printed Circuit Board Assembly Contact Now	Quick View Premium 6 Layer PCB for Electronic Camera Lenses Contact Now

Transaction Info
	Quick View Coverlay Polyimide Plus adhesive Steel/Pi Stiffener HDI Rigid-Flex PCB Board Manufacturer Contact Now	Quick View Fast Delivery Double Side Fr4 PCB Circuit Board Assembly Contact Now	Quick View Electronic OEM Customized Copper PCBA Manufacturer Contact Now	Quick View OEM Professional Electronic Printed Circuit Board Assembly Contact Now	Quick View Premium 6 Layer PCB for Electronic Camera Lenses Contact Now
Price	US $ 1.20-7.80/ pcs	US $ 2.68-5.60/ Piece	US $ 2.68-5.60/ Piece	US $ 2.68-5.60/ Piece	US $ 2.70-2.82/ Piece
Min Order	1 pcs	1 Pieces	1 Pieces	1 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay	T/T
Quality Control
Product Certification	-	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	-
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Type: Rigid-Flex Board; Dielectric: Fr4+Pi; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Hspcb; Customized: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.15mm/0.2mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Enig;
Supplier Name	Shenzhen Hesheng Circuit Technology Limited	Mu Star (shenzhen) Industry Co., Ltd.	Mu Star (shenzhen) Industry Co., Ltd.	Mu Star (shenzhen) Industry Co., Ltd.	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.
Select All

Contact Now

Hot Search