What is Customized Oversize FPC Coverlay with Pi Plus Adhesive/Stiffener Flexible PCB Board Manufacturer

Name: Customized Oversize FPC Coverlay with Pi Plus Adhesive/Stiffener Flexible PCB Board Manufacturer
Uploaded: 2023-06-12T16:11:43+08:00
Description: WHY USE HSPCB FOR YOUR PCB MANUFACTURING SERVICES? It can be a challenge to find the optimal supplier for PCBs - meeting each and all customer's expectations and requirements on price, quality, lead

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About this Item

Price

Min. Order Reference FOB Price

1 pcs US$0.30-1.20 / pcs

Sepcifications

Type Flexible Circuit Board
Dielectric Pi
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Fexible
Processing Technology Delay Pressure Foil
Base Material Pi
Insulation Materials Epoxy Resin
Brand Hspcb
Transport Package Vacuum Packing
Specification Customized
Trademark Customized
Origin China
Customized Yes

Product Description

WHY USE HSPCB FOR YOUR PCB MANUFACTURING SERVICES? It can be a challenge to find the optimal supplier for PCBs - meeting each and all customer's expectations and requirements on price, quality, lead times, value-added services, and delivery. You will find options below on our different ...

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Shenzhen Hesheng Circuit Technology Limited

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB Research and Development, PCB Manufacturing and Sales, PCB Domestic Sales and Export Trade, PCB Assembly and Surrounding Components Sales, PCB Dfm Review & Analysis, PCB Lifecycle Management, PCB Surrounding Components Sales
Registered Capital 50000000 RMB
Plant Area 9800 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

FPC Comparison

	Quick View Customized Oversize FPC Coverlay with Pi Plus Adhesive/Stiffener Flexible PCB Board Manufacturer Contact Now	Quick View Controller PCB Assembly OEM PCBA Manufacturer for Mobile Phone Contact Now	Quick View One-Stop PCBA Manufacturing Service with PCB Soldering Contact Now	Quick View Eight Multilayer PCB OSP Board for Smart Watches with Immersion Gold Contact Now	Quick View Ten Multilayer PCB HDI Board for Bluetooth Speakers with Immersion Gold Contact Now

Transaction Info
	Quick View Customized Oversize FPC Coverlay with Pi Plus Adhesive/Stiffener Flexible PCB Board Manufacturer Contact Now	Quick View Controller PCB Assembly OEM PCBA Manufacturer for Mobile Phone Contact Now	Quick View One-Stop PCBA Manufacturing Service with PCB Soldering Contact Now	Quick View Eight Multilayer PCB OSP Board for Smart Watches with Immersion Gold Contact Now	Quick View Ten Multilayer PCB HDI Board for Bluetooth Speakers with Immersion Gold Contact Now
Price	US $ 0.30-1.20/ pcs	US $ 0.10-24.20/ Piece	US $ 0.10-24.20/ Piece	US $ 3.91-3.92/ Piece	US $ 3.91-3.92/ Piece
Min Order	1 pcs	1 Pieces	1 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T	T/T
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	-
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-	-
Product Attributes
Specification	Type: Flexible Circuit Board; Dielectric: Pi; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Pi; Insulation Materials: Epoxy Resin; Brand: Hspcb; Customized: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Jhwl; Surface Finish: HASL,Enig,OSP; Solder Mask: Green/Black/White/Red/Blue/Yellow; Biggest Panel Size: 610mm508mm;* Hole Posito: +/-0.075mm(3mil) CNC Driling;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: Jhwl; Surface Finish: HASL,Enig,OSP; Solder Mask: Green/Black/White/Red/Blue/Yellow; Biggest Panel Size: 610mm508mm;* Hole Posito: +/-0.075mm(3mil) CNC Driling;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Immersion Gold;
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