Specification |
Structure: Single-Sided FPC;
Material: Copper;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: Max 5oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi PE;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Smallest Chips Size: 0201;
Min BGA: 0.008 in. (0.2mm);
Max PCB Size: 14.5 in. X 19.5 in;
PCB Shape: Any;
Surface Treatment: OSP, Enig, Immersion Silver/Tin, Gold Plating;
Min Thickness: 0.02mm;
Cover Film Color: Black, Yellow, Brown and White;
Solder Mask: Green. Red. Blue. White. Black;
Layer: 1-8;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi PE;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Smallest Chips Size: 0201;
Min BGA: 0.008 in. (0.2mm);
Max PCB Size: 14.5 in. X 19.5 in;
PCB Shape: Any;
Surface Treatment: OSP, Enig, Immersion Silver/Tin, Gold Plating;
Min Thickness: 0.02mm;
Cover Film Color: Black, Yellow, Brown and White;
Solder Mask: Green. Red. Blue. White. Black;
Layer: 1-8;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi PE;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Smallest Chips Size: 0201;
Min BGA: 0.008 in. (0.2mm);
Max PCB Size: 14.5 in. X 19.5 in;
PCB Shape: Any;
Surface Treatment: OSP, Enig, Immersion Silver/Tin, Gold Plating;
Min Thickness: 0.02mm;
Cover Film Color: Black, Yellow, Brown and White;
Solder Mask: Green. Red. Blue. White. Black;
Layer: 1-8;
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Flame Retardant Properties: V0;
Processing Technology: HASL Lead Free;
Base Material: Aluminum LED;
Insulation Materials: Metal Composite Materials;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 3: Flex-Rigid PCB;
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