FPC
US$0.50-10.00 / Piece
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What is Special Customized Multi-Layer FPC with Adhesive Flexible Plate by Flex Plus in China

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

  • Structure Multilayer FPC
  • Material Copper
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Flame Retardant Properties V0
  • Processing Technology Des
  • Base Material Polyimide
  • Insulation Materials Polyimide
  • Brand Flex Plus
  • Transport Package Vacuum Package with Foam Protection & Carton
  • Specification Customized
  • Trademark Flex Plus
  • Origin China
  • Copper Thickness 1/3 Oz ~2 Oz
  • Length Max. 4m (XL Exposure Machine)
  • Line Width Min 0.05mm
  • Color Yellow, Green
  • Sample Delivery 3~5days
  • MP Delivery 7~10days
  • Soler Mask Allignment Tolerance 4mil
  • Silkscreen Alignment Tolerance 6mil
  • Layer 2+2

Product Description

ABOUT US Established in 2004, Flex Plus (Xiamen) Co., Ltd. is dedicated in high-quality &cost effective flexible printed circuit board (Flex PCB) R&D, manufacturing and sales. To effectively respond to the technological expectations of its customers and satisfy the different market needs, Flex ...

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FPC Comparison
Transaction Info
Price US $ 0.50-10.00/ Piece US $ 0.01-10.00/ Piece US $ 0.82-2.36/ Piece US $ 0.82-2.36/ Piece US $ 0.15-0.38/ Piece
Min Order 1 Pieces 1000 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, D/P L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal, Alipay
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$10 Million - US$50 Million - - -
Business Model OEM, ODM OEM, ODM, Own Brand(FPIC) OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow, Green;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Soler Mask Allignment Tolerance: 4mil;
Silkscreen Alignment Tolerance: 6mil;
Layer: 2+2;
Structure: FPC Connector;
Material: Thermoplastic;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Electronics;
Base Material: Copper;
Current Rating: 0.5AMP;
Insulation Resistance: 500mΩ Min;
Contact Resistance: 50mΩ Max;
Withstanding Voltage: AC 150V Min;
Operating Temperature: -40 Degree to +85 Degree;
Contact Material: Copper Alloy;
Contact Plating: Gold or Tin Over Nickel;
Insulation Material: Thermoplastic UL94V-0;
Color: Black;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
PCB Layer: 1-26 Layers;
SMT Line Quantity: : 30;
Solder Mask: Any;
Silk Screen: Any;
Surface Treatment: HASL;
PCB Assembly Type: SMT and DIP;
PCB Service: One Stop Service;
Small Orders: 1 PCS Is Ok;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Board Dimensions: Smallest Size: 50*50mm;
BGA-Min Pitch: 0.25mm;
Testing Procedures: Visual Inspection ; X-ray Inspection ;Aoi (Automat;
Board Shape: Rectangular ; Round ;Slots and Cut Outs; Complex a;
Lead Time: 12-20 Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
PCB Layer: 1-26 Layers;
SMT Line Quantity: : 30;
Solder Mask: Any;
Silk Screen: Any;
Surface Treatment: HASL;
PCB Assembly Type: SMT and DIP;
PCB Service: One Stop Service;
Small Orders: 1 PCS Is Ok;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Board Dimensions: Smallest Size: 50*50mm;
BGA-Min Pitch: 0.25mm;
Testing Procedures: Visual Inspection ; X-ray Inspection ;Aoi (Automat;
Board Shape: Rectangular ; Round ;Slots and Cut Outs; Complex a;
Lead Time: 12-20 Days;
Structure: Single-Sided FPC;
Material: Fr4 + Polymide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 + Polymide;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Material: Fr4 + Polymide;
Board Thickness: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Surface Treatment: Yellow;
Lead Time: 5-7 Working Days;
Small Order: Accepted;
PCB Name: FPC Printed Circuit Board Rigid Flex PCB & PCBA;
Min Pad Size: 0.2mm;
Pattern Registration Tolerance: +/-0.1mm--Working Panel Size: 250*300mm;
CNC Drill (Min): Flex:;0.15mm;
Min Line Width / Spacing: 0.075/0.075mm;
CNC Drill Size (Max): 6.5mm;
Supplier Name

Flex Plus(Xiamen) Co., Ltd

Gold Member Audited Supplier

SHENZHEN FORMAN PRECISION INDUSTRY CO., LTD.

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier