| Specification |
Structure: Multilayer FPC;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow, Green;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Soler Mask Allignment Tolerance: 4mil;
Silkscreen Alignment Tolerance: 6mil;
Layer: 2+2;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um,1oz,2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Metal Composite Materials;
Place of Origin: Guangdong, China;
Copper Thickness: 12um--70um;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.05mm;
Min. Line Spacing: 0.05;
Surface Finishing: OSP, Enig, Immersion Tin;
FPC Material: Polyimide;
Board Thickness: 0.075-6.0mm;
Solder Mask Color: Yellow, Black, White, Green, Red, Blue;
FPCB Thickness: Custom;
Sbccy: Rzngdsb;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Metal Composite Materials;
Brand: Cutomize;
Place of Origin: Guangdong, China;
Copper Thickness: 12um--70um;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.05mm;
Min. Line Spacing: 0.05;
Surface Finishing: OSP,Enig,Immersion Tin;
FPC Material: Polyimide;
Board Thickness: 0.075-6.0mm;
Solder Mask Color: Yellow,Black,White,Green,Red,Blue;
FPCB Thickness: Custom;
Sbccy: Rzngdsb;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Metal Composite Materials;
Brand: Cutomize;
Place of Origin: Guangdong, China;
Copper Thickness: 12um--70um;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.05mm;
Min. Line Spacing: 0.05;
Surface Finishing: OSP,Enig,Immersion Tin;
FPC Material: Polyimide;
Board Thickness: 0.075-6.0mm;
Solder Mask Color: Yellow,Black,White,Green,Red,Blue;
FPCB Thickness: Custom;
Sbccy: Rzngdsb;
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