Specification |
Structure: Multilayer FPC;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4mm (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow, Green;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Soler Mask Allignment Tolerance: 4mil;
Silkscreen Alignment Tolerance: 6mil;
Layer: 2+2;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Polyimide;
Brand: Slp;
Sample: Avaliable;
Width: 25cm;
Composition: Polyimide +Copper+Glue;
Copper Thickness: 12um-100um;
Layer: Single /Double;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Polyimide;
Brand: Slp;
Sample: Avaliable;
Width: 25cm;
Composition: Polyimide +Copper+Glue;
Copper Thickness: 12um-100um;
Layer: Single /Double;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Polyimide;
Brand: Slp;
Sample: Avaliable;
Width: 25cm;
Composition: Polyimide +Copper+Glue;
Copper Thickness: 12um-100um;
Layer: Single /Double;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi+Pi/Fr4 for Stiffener;
Insulation Materials: Organic Resin;
Brand: Exceeding;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Delivery: 5days;
Keyword: FPC;
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