Flex Plus High Quality Rigid-Flex PCB with ISO9001 ISO13485 IATF16949 UL Certificate

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.33-10.00 / Piece

Sepcifications

  • Structure Double-Sided FPC
  • Material Copper
  • Combination Mode Without Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Flame Retardant Properties V0
  • Processing Technology Des
  • Base Material Polyimide
  • Insulation Materials Polyimide
  • Brand Flex Plus
  • Transport Package Vacuum Package with Foam Protection & Carton
  • Specification Customized
  • Trademark Flex Plus
  • Origin China
  • Copper Thickness Max 5oz
  • Length Max. 4m (XL Exposure Machine)
  • Line Width Min 0.05mm
  • Color Yellow
  • Sample Delivery 3~5days
  • MP Delivery 7~10days

Product Description

ABOUT US Established in 2004, Flex Plus (Xiamen) Co., Ltd. is dedicated in high-quality &cost effective flexible printed circuit board (Flex PCB) R&D, manufacturing and sales. To effectively respond to the technological expectations of its customers and satisfy the different market needs, Flex ...

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FPCB Comparison
Transaction Info
Price US $ 0.33-10.00/ Piece US $ 0.01-150.00/ Piece US $ 0.10-100.00/ Piece US $ 0.10-20.00/ Piece US $ 0.01-100.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net
Quality Control
Product Certification - - UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 - -
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Double-Sided FPC;
Material: Copper;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: Max 5oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
PCB Material: Fr4 Tg180;
Thickness: 1.5mm;
Copper: 35um;
Impedance Control: No;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Special Process: Stiffeners etc;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Enig Thickness: 1-3u'';
Copper Thickness: 0.5-8oz;
Hard Gold Thickness: 5-50u'';
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polymide;
Insulation Materials: Epoxy Resin;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.2mm;
Copper Thickness: 35 Um;
Surface Finish: Enig;
Outline: Module Punch;
Supplier Name

Flex Plus(Xiamen) Co., Ltd

China Supplier - Gold Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier