| Specification |
Structure: Single-Sided FPC;
Material: Copper;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: Max 5oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um,1oz,2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um, 1oz, 2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Fr4 Halogen Free, Roger;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
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